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Advantest Hosts 10th Anniversary VOICE 2016 Developer Conference

voiceAdvantest marked the 10th anniversary of its VOICE 2016 Developer Conference this year with 129 technical breakout sessions, two Partners’ Expos, 17 technology kiosks and multiple networking opportunities for members of the semiconductor test industry at dual events in San Diego, Calif., on May 10-11, and at Taiwan’s first VOICE conference in Hsinchu on May 18. Altogether, a record high of nearly 600 people attended the events, including 300 industry professionals in Taiwan – the most ever for a VOICE location outside of the United States.

At the U.S. session, there were 99 technical presentations – 20 more than last year – while the Taiwan conference featured 30 papers – six more than 2015’s VOICE event in Shanghai.  Advantest customers accounted for the majority of this year’s paper authors. Sixty percent of the papers in San Diego and 53 percent in Taiwan were either customer authored or co-authored.  In total, VOICE 2016 featured technical papers from 35 companies representing 12 countries, including the first participation from Ireland.  The event’s international appeal and the diversity of its seven technical tracks covering the newest semiconductor test methodologies continue to attract new participants, with 44 first-time attendees.

VOICE is managed by a steering committee of volunteer representatives from Advantest and its customers, and is the leading conference for the growing international community of users and strategic partners involved with Advantest’s T2000 and V93000 SoC test platforms as well as Advantest memory testers, handlers and test cell solutions.  Attendees gain and share valuable insights, build long-lasting relationships and learn what’s new about Advantest test equipment, handlers and applications, as well as technology trends that are not related to specific equipment.

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Advantest’s VOICE 2016 Developer Conference Issues International Call for Papers

Advantest has issued an international call for papers on semiconductor test solutions, best practices and innovative technologies for its tenth annual VOICE Developer Conference. Based on the success of holding VOICE sessions in China and the U.S. this year, the 2016 conference will again be held on both sides of the Pacific Ocean — in San Diego, California on May 10-11 and in Hsinchu, Taiwan on May 18 — with the unifying theme of “10 Wonders of Technology” in recognition of the 10th anniversary of VOICE.

globeVOICE 2016 will offer attendees comprehensive learning and networking opportunities, including technical presentations, a partners’ exposition, social gatherings and the first-ever presentation track focused on new solutions in design technology and materials for loadboards and probe cards from various companies. In addition, the San Diego event will be the site of interactive discussion sessions for users of Advantest’s V93000 and T2000 system-on-a-chip (SoC) test platforms, memory testers, handlers, test cell solutions, product engineering and test technology.

International Attendance

Each year, the world’s semiconductor industry personnel from leading integrated device manufacturers (IDMs), foundries, fabless semiconductor companies and outsourced assembly and test (OSAT) providers come together at VOICE to share ideas and information as colleagues.

“VOICE has always been an engineering conference — created by test engineers for test engineers — for sharing useful, relevant solutions and best practices that can be applied directly to today’s most pressing test challenges,” said Mark Nagel, chairman of VOICE 2016 and Advantest staff applications engineer. “Now with the expansion of VOICE to include product engineering content, our 2016 conference is a can’t-miss event. As we mark VOICE’s tenth anniversary, we’ll be celebrating how this developer conference has evolved and grown with the IC test industry while also recognizing the people and innovations that have made VOICE so successful. I invite the world’s test community to join us in paradise — the beautiful Paradise Point Resort & Spa in San Diego — and/or at our second international location, in Hsinchu, Taiwan.”

Informative Technical Presentations

The VOICE 2016 call for papers focuses on seven technology tracks:

  • Hot Topics concerns new market drivers and future trends including security and encryption, emerging wireless standards, test challenges at next-generation technology nodes, the Internet of Things (IoT), automotive solutions and smart houses.
  • Device-Specific Testing covers techniques for testing MCUs, ASICs, PMICs, automotive radar, sensors, memory, baseband, cellular, multi-chip packages and more.
  • Hardware Design and Integration includes tester/handler integration, probe and package loadboard design challenges of new package technologies and fine-pitch devices, and more.
  • Improving Throughput addresses test-time reduction, increased multi-site efficiency, concurrent testing, data analysis, and more.
  • Reducing Time to Market encompasses DFT, pattern simulations/cyclization, automatic test program generation, system-level test, and more.
  • New Hardware/Software Test Solutions focuses on solutions utilizing the latest hardware or software features.
  • Test Methodologies involves techniques for testing DC, RF, mixed-signal or high-speed digital devices.

Test developers are invited to submit their abstracts for consideration at either the San Diego or Taiwan locations, or both, by going to https://voice.advantest.com/call-for-papers. All submissions must be received by November 20, 2015. Accepted presenters will be notified in January 2016. Audience members at the conference sessions in May 2016 will vote for the best papers, with winning presenters receiving prizes.

Attending VOICE 2016

VOICE 2016 registration will open in January. Industry members interested in attending the San Diego event can reserve hotel rooms now by calling 1-800-344-2626 and mentioning Advantest America or by visiting the hotel’s website. To arrange hotel rooms for the Taiwan event in Hsinchu, email mktgcomms@advantest.com.

For more information about the VOICE 2016 Developer Conference, including sponsorship opportunities, please visit https://voice.advantest.com/ or email mktgcomms@advantest.com.

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Optimizing the True Cost of Test for SSDs

By Scott West, SSD Marketing Manager for Advantest America, and Mark Webb, Industry Consultant at MKW Ventures

With market analysts forecasting that production of solid-state drives (SSDs) will rise to more than 200 million units per year by 2017, device manufacturers need a reliable, high-volume, cost-efficient test solution to serve this rapidly growing market.

For SSD makers, focusing solely on the cost of test (COT) can be misleading. COT is calculated by dividing a piece of equipment’s purchase price by its throughput. While this is a valuable metric, it provides only a snapshot of one point in the lifetime of a tester.

Look at Total Cost of Ownership

To more accurately gauge the economic performance of a tester over time, SSD manufacturers should look at the total cost of ownership (TCO), which takes into consideration not just an item’s initial price, but also longer term considerations such as operating costs and maintenance. For instance, the expense of load boards and consumable materials, power usage, floor-space requirements and operator costs all factor into TCO.

Other considerations include intangibles such as service and support agreements, the length of cycle times and the turnaround time in procuring spare parts. Even an ATE supplier’s “staying power” can affect TCO. This is because semiconductor manufacturers need reliable equipment suppliers that are guaranteed to be around to help them quickly ramp up capacity when needed, to continually find innovative ways to drive down the cost of test and to develop new test technologies to address tomorrow’s market opportunities.

Maximize Your ROI

Because not all testers are created equal, throughput and productivity levels often vary for different systems. So meeting a chip maker’s throughput needs could require only three testers from one supplier, but four systems from another. For example, a PC-based tester might handle 25,000 to 30,000 I/Os per second when testing SSDs with standard second-generation PCIe interface protocols. However, a high-performance system such as Advantest’s MPT3000 platform, equipped with both address and data accelerators, can test eight SSDs simultaneously. This highly parallel testing translates to 260,000 I/Os per second, a throughput boost that dramatically improves TCO.

Another factor to consider is changing market conditions. While rudimentary PC-based testers may come with a lower initial price point, systems that are optimized for flexibility – with scalable architectures, the versatility to test a wide range of today’s device designs and the forward-looking ability to be reconfigured to meet future needs – will provide significantly better TCO in the long run.

As an example, let’s look at a SSD production facility using PC-based test equipment that is turning out a 50-50 mix of devices with PCIe interfaces and SAS interfaces. If market demand shifts and the company wants to adjust its production to 67 percent PCIe devices and 33 percent SAS products, it would need to purchase and ramp up more PC-based testers to handle the additional PCIe SSDs while idling some of its installed SAS-compatible testers.ssd2

Only by using reconfigurable test equipment could the company accommodate the new product mix without buying extra capital equipment, dedicating more floor space and bringing in additional operators. Advantest’s MPT3000 tester can be repurposed quickly and easily by downloading new firmware for SAS, SATA and PCIe protocols, making it the most flexible and extendible single-system test solution for SSDs.

A Future Enabled by Flexible Testing

The MPT3000’s flexibility makes it an especially appealing tool for out-sourced assembly and test (OSAT) foundries, which offer SSD makers the opportunity to avoid capital costs in testing their devices. The OSAT business model is based on testing a wide variety of devices in high volumes for multiple customers so these foundry operations need highly versatile test equipment with true multi-protocol support in a single system. While the OSAT model is well established in testing most semiconductor devices, this approach is a new undertaking for the SSD market. Still, the advent of SSD-focused test foundries has strong potential to shorten the time to market and drive down the cost of test for new SSD products.

Young, fast-growing semiconductor markets are characterized by quick shifts in market demand, which force device manufacturers to be agile enough to quickly re-balance their manufacturing levels for various products. This puts a premium on highly flexible test capabilities. For the high-volume, cost-sensitive SSD market, Advantest’s MPT3000 system provides the optimal solution.

ssd1

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Getting from R&D to IoT with the EVA100

By Anthony Lum, Business Development Manager, Advantest America, Inc.

EVA Article Figure 1

Figure 1

The Internet of Things (IoT) is one the most ubiquitous technology-related topics these days. It’s become one of the tech buzzwords that transcend discussion in trade publications and blogs, showing up regularly in consumer and business publications as speculation swirls about when, where and to what extent IoT products are being deployed. Currently, the broadest applications for IoT solutions are automotive environments, from which myriad products can be launched and controlled, and household uses, including appliances, lighting and environment controls.

In the semiconductor world, analog integrated circuits (ICs) represent a key aspect of IoT. The need for analog ICs has increased in near direct proportion to the number of smart wireless devices on the market. With IoT device volumes expected to top these numbers, analog ICs will play an even more critically important role due to the higher performance, tighter accuracy and longer reliability that IoT devices require. In addition, analog ICs are essential to the rapid device characterization and fast delivery of customer samples the engineering community demands.

R&D engineers previously addressed these challenges by employing classic rack-and-stack or PXI benchtop instrumentation. These solutions were the best fit because of their broad technical reach. However, time-perishable deliverables proved extremely challenging because R&D engineers faced the additional task of developing system software to control and integrate the non-automated benchtop solutions. This undertaking requires strong coding skills and a more comprehensive knowledge of each of the benchtop instruments’ operation than the engineers typically possess. Manual measurement, on the other hand, is cumbersome and hampers rapid turnaround of deliverables.

EVA Article Figure 2

Figure 2

One solution that addresses this range of challenges is Advantest’s EVA100 measurement system, whose step-function integration is a significant improvement over classic benchtop instruments. The EVA100’s “all-in-one” concept integrates functions for a hose of instrumentation – power supplies, 4-quadrant DC signal measurement units, pattern generators, logic analyzers, arbitrary waveform generators, digitizers and oscilloscopes – into a single, modular unit. Each of these functions replaces standalone, focused instruments necessary to perform comprehensive evaluation and measurement of linear, automotive and industrial devices. Figure 2 shows how the EVA100 greatly simplifies analog IC device setup and replaces the need for six standalone, classic, benchtop instruments.

The “all-in-one” EVA100, also nicknamed the “shoe-box,” has a small footprint and is lightweight, portable and runs on standard 120V AC – all of which facilitates moving the unit from desktop to desktop, or into the lab as needed. The same hardware and setup can be preserved at any measurement station or node, assuring data acquisition consistency and correlation.

Rapid turnaround can be inhibited by development of complex software. Historically an underscoped task that tends to takes longer than expected to complete, software development is also complex and depends on users’ experience and comfort level. Software development is not needed with the EVA100, thanks to its newly developed, highly intuitive software GUI. With its drag-and-drop operation, the software interface enables engineers to quickly and easily create device-focused measurement set-ups. Automatic report functions dramatically improve deskwork efficiency, providing clear documentation and data ready for publishing in device data sheets.

The EVA100 combines Advantest’s unparalleled ATE and benchtop expertise to synergistically deliver a benchtop-measurement system that is fully modular and delivers benchtop-accuracy hardware along with intuitive GUI software delivering a complete turnkey solution. Priced competitively to benchtop instruments to ensure maximize ROI, the fully integrated EVA100 is often lower priced than an equivalent piecemeal rack or PXI instrument configuration. With software also included as part of the system’s package, the IoT-optimized EVA100 solves the two-pronged challenge of rapid device characterization and high performance quantitative data for a wide range of analog ICs.

About the Author

Anthony Lum joined Advantest America in 2006 and is currently ASD Business Development Manager. He amassed over 25 years of ATE experience specializing in RF and Analog SoC device testing through roles as a test engineer, applications engineer, and test and applications management at Texas Instruments and HP/Agilent. He received his BSEE at Arizona State University in 1986 and has authored over 20 IEEE and industry papers.

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IoT and Smart Applications Pose New Testing Challenges

By Adriano Mancosu, Business Development Manager,  Advantest

Every day, it seems, the number of “smart” products and applications in our lives expands – we are seeing this not only in the automotive space and consumer products (particularly wearables), but also in retail, commercial and industrial settings. At the heart of all this new smart technology is what is known as the “Internet of Things,” or the IoT – a term whose definition is still difficult to pin down (and tends to depend on whom you ask).

Freescale_IoT_TruckFrom Advantest’s perspective, the IoT requires three primary building blocks that, when combined, enable a wide range of new applications for which massive growth is anticipated. These blocks are:

  • Computing – the processor/controller and associated software;
  • Sensors/actuators – the actual physical and mechanical output; and
  • Connectivity – this includes both wireless and wired protocols.

As you may have heard, the IoT will drive 10x more devices per year than smartphones, but the number of applications will grow exponentially – by at least 100x. With this breadth of volume, it will be impractical to develop the kinds of customized, high-end devices for IoT that have been created for smartphones. Thus, the industry needs to come up with manufacturing and test solutions that are adaptable for repurposing in multiple applications.

This also highlights the opportunity that the IoT market creates for smaller companies. While just a few semiconductor makers own 80 percent of the smartphone market, there will be any number of new players who can build a solution based on a unique concept. To bring these solutions to market, they will need to tap the services of semiconductor assembly and test subcontractors. Advantest, with its broad installed base and ecosystem of partners, is one company with the flexibility to help these new players get to market faster.

Testing the IoT

Each of the three IoT building blocks creates unique challenges for test. The microcontroller drivers test toward the highest possible parallel as it requires lengthy test times, while DC accuracy is a key driver for sensors due to their need for a stimulus. On the connectivity front, RF devices, specifically, operate at very high frequencies, which the test process must take into account due to some of the peculiarities this creates within the device.

 

Building Block Test Challenge
Computing High parallelism
Sensor High DC accuracy
Connectivity High RF frequency

 

No tester company currently offers a solution enabling all three devices to be tested at once. While individual test will continue for the near future, the market will undoubtedly be driven toward a single testing platform due to the need to reduce test costs and times. The tester and handler will need to deal with a highly complex range of requirements, and combining the three devices together will require a number of compromises – highlighting the fundamental need for ATE flexibility and scalability.

Covering RF for the many lower-power connectivity standards – e.g., Bluetooth Low Energy, ZigBee, 2.4G and others – will certainly require a high degree of flexibility. Most of the sensors used today for the IoT and wearables are either motion (accelerometers, gyroscopes) or environmental (humidity and pressure devices). Testing these components requires a cable interface, as the handler is either moving the parts or located in a humid/hot chamber.

The question of how much revenue ATE companies will ultimately realize around IoT and smart devices is murky at this point, as software services offered by ATE providers will play a key role, and how much will be required is not fully known. In addition, cloud computing is driving solid-state drive (SSD) memories and high-end application processors. With all these variables in play, we anticipate an exciting environment developing over the next few years.

With no single platform developed to address these varied testing needs, growing parallelism and more specifications demand an approach such as the Advantest V93000 “universal pin” test system. Its flexible architecture provides a solution for driving at the end of a 100-inch cable a resource that can be a digital, DC, mixed-signal and RF solution. Because any handler can utilize this interface, the user can simply work on the handler side without having to make any changes on the tester side. To accommodate additional modules, the user need only select the correct tool, making the V93000 a proven, viable option for testing IoT and smart devices.

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VOICE 2015 Attracts Over 400 Attendees on Two Continents

 

2015_VOICE_logo

Advantest made its VOICE 2015 Developer Conference a truly international forum in May by holding the event in both Santa Clara, Calif., and Shanghai, China – the first time that this annual gathering of test equipment users, suppliers and partners has been held outside the United States. More than 400 people attended the events, which featured 79 technical papers on May 12-13 in Silicon Valley and 24 presentations on May 22 in Shanghai.

In addition to its geographic growth, VOICE 2015 also set a new record for international speakers with presenters coming from 14 countries, up from 11 last year. The conference continues to expand by including new companies and new ideas. Of the 134 abstracts submitted this year, more than 41 percent came from authors who had not presented at any prior VOICE conferences. Among those candidates trying to become first-time presenters at VOICE, more than 78 percent were from Advantest customers, an indicator of the high value that chipmakers place on this annual forum.

The sessions were packed with technical talks on topics such as the latest testing capabilities enabled by Advantest’s V93000 and T2000 platforms, production test cells, product engineering and emerging test technologies. In addition, attendees benefited from multiple networking opportunities at both events.

VOICE in Silicon Valley

In Silicon Valley, VOICE began with a welcome address by Advantest America, Inc. President and CEO Doug Lefever. Technical product highlights were presented by Andree Weyh, Amit Monga and Zain Abadin of Advantest. Then global adventurer and award-winning author Paul Deegan gave an inspirational keynote address called “Breathless: Embracing Uncertainty at 29,000 Feet.” On the second day, many attendees spoke directly with Advantest test experts at on-site kiosks. After the two-day conference, a supplemental day of workshops was offered at Advantest’s San Jose headquarters for customers wanting more detailed, hands-on training.

VOICE in China

The inaugural VOICE in Shanghai, which was completely filled several weeks before the event, opened with a welcome speech by Yong Xu, CEO of Advantest China Co., Ltd. The keynote speaker was Dr. Jonathan Sang, senior director of the Testing & Outsourcing Unit from HH Grace, who spoke on “Diversified Technologies for the Wearable Market.”

Best Paper Awards

With technical presentations at its core, VOICE recognizes the best paper at each conference with an award judged by attendees. This year’s winners at the Silicon Valley event were Luis Neria Govea of Qualcomm and Frank Dollendorf of Advantest for their talk on “Different Methods for Run-Time Vector Manipulation and Their Test Time Impacts.” In Shanghai, the best paper award went to Michael Min and Liang Ge of Advantest for their presentation entitled “Examining a Sequencer-Controlled Search-Trimming Solution with Conditional Jump.” VOICE 2015 attendees may obtain instructions on how to get the published proceedings on the conference website at www.advantest.com/voice

Thank You to the VOICE 2015 Supporters & Sponsors

For the first time, the 2015 conference was supported by four industry organizations: SEMI, the Global Semiconductor Alliance (GSA), VLSIresearch and IC Insights. Advantest also extends a special thank you to the 14 companies who sponsored VOICE 2015:

 

 EAG  ise_gold_sponsor
 Alliance ATE  Johnstech
 reid-ashman  sv-tcl
 tssi  test-insight
 rd-altanova  w2bi
 anora  galaxy
 huber-suhner  winway

 

VOICE 2016

In 2016, the Advantest VOICE Developer Conference will mark its tenth anniversary. Program details will be posted online in the coming months.

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