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EVA100 Digital Solution Offers Design-Production Testing

Many IoT-enabled electronic products receive information in analog form, then convert it into signals for transmission. This requires the use of integrated digital ICs. These semiconductors are extremely cost sensitive, and the markets for them are highly competitive.  In addition, digital ICs are used in a wide range of applications, many of which impose stringent safety and reliability standards that put a premium on device performance and accuracy. For these reasons, producers of digital ICs typically employ high-mix, low-volume production methods, which require highly versatile and cost-efficient testing capabilities.

With its flexible architecture, Advantest’s new EVA100 Digital Solution can perform all of the functions needed for testing digital ICs, as well as pattern generation and comparison for evaluating device designs, digital control, power source measurements and 18bit analog measurements. It can conduct all of these measurements at 100Mbps data-transfer rates and up 200MHz clock speeds, resulting in high-efficiency testing.

EVA100 Digital Solution is the latest member in an expanding line of EVA100 measurement systems for testing a broad variety of digital ICs, including IoT devices, microcontroller units (MCUs), design-for-test (DFT) and built-in self-test (BIST) semiconductors and logic ICs. It is available in both production and engineering models, with capabilities that include design evaluation, front-end and back-end measurements, fault analysis, package verification and acceptance inspection of devices.

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EVA100 Digital Solution

      

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Fully Integrated Digital Testing Needs

The new digital solution enables a customer to establish a common measurement environment throughout a facility, from design evaluation through production – achieving efficiency-boosting standardization that is unmatched by any existing measurement instrument or system. Furthermore, it is 40 percent smaller than the initial EVA100 measurement system, saving time and money by simplifying operation and making periodic maintenance much easier.  Scaling down the architecture also helps the EVA100 Digital Solution to deliver both high reliability and industry-leading productivity.  With each compact unit having a maximum of 256 measurement channels, as many as four EVA100 Digital Solutions can be clustered together to create configurations of up to 1,024 digital channels.  This enables the system to match manufacturing volumes with market needs by readily accommodating changes in production volumes and line retooling for different device types.  It also gives users the flexibility to optimize test environments for logic circuits and IoT devices, many of which utilize DFT.  Additionally, the measurement system can apply the same test programs for design and evaluation as for production, eliminating the need to change program codes and accelerating new devices’ time to market.

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Simultaneous Measurement Solution for High-volume ICs

With market demand growing for price-sensitive ICs used in automotive, smart phone and other high-volume applications, conducting simultaneous measurements of multiple semiconductors has become vital to test cost reduction. Performing such highly parallel testing requires a performance board capable of handling the many circuit loads necessary for testing today’s most advanced analog devices.

Ideally suited to this requirement is Advantest’s new RECT550EX HIFIX (High-Fidelity Test Access Fixture),  which enhances the capabilities of its T2000 system-on-chip (SoC) test platform in performing highly parallel testing With  50 percent more application space and a capability of handling 30 percent more channels than its predecessor, highly parallel and simultaneous measurements can now easily be attained.

The T2000 platform is capable of accommodating several high-density test modules in the test head. The RECT550EX HIFIX enables the T2000 to take full advantage of these modules by allowing the system to be configured as needed for any device under test (DUT), including automotive semiconductors and power-management ICs. In addition, the new HIFIX unit maintains full compatibility with Advantest’s standard RECT550 HIFIX performance boards. When equipped with the RECT550EX HIFIX, the T2000 SoC tester can achieve an extremely low cost of test.

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Wireless Data Logger Revolutionizes Automotive Industry Processes

Advantest’s new AirLogger WM1000 is the widely anticipated wireless data logger for commercial applications. Compliant with FCC regulations and certified under the Technical Regulations Conformity System of Japan, the WM1000 has diverse uses in the automobile industry and beyond, from R&D to the production floor.

The AirLogger’s sensor unit, which incorporates a thermocouple data processor, wirelessly sends temperature data to a PC for display and saving. It can measure temperatures at 100 points, and can also measure the temperatures of moving and rotating objects, such as wheels, which are difficult to measure with existing temperature loggers. These capabilities give the AirLogger a wide range of applications in diverse sectors. The AirLogger has been praised by early adopters as a revolutionary instrument that cuts thermocouple setting time by 80%, and enables previously impossible temperature measurements of moving wheels and brakes.

In the automotive industry, and many other manufacturing and R&D fields, temperature measurement and evaluation are normally performed with data loggers whose measurement units and data processing units are connected by cables. Set-up, measurement, and breakdown take a considerable length of time, impacting process efficiency. Additionally, in recent years, measurement targets have become smaller, creating a need for smaller sensor units and simultaneous multiple point measurement functionality. Advantest’s AirLogger series addresses all of these challenges with its revolutionary wireless solution for temperature logging.

Customers adopting the AirLogger have seen dramatic productivity gains, as they are freed from the constraints of working with data cables.

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Key Features of the AirLogger:

  • Compact, Fully Wireless Design Dramatically Boosts Efficiency
    The AirLogger’s sensor units use button batteries for their power supplies and transmit temperature measurements wirelessly. The fully cable-free configuration enables dramatic productivity gains and enables easy temperature measurement for formerly difficult-to-measure targets such as revolving tires and other moving objects.
  • Real-Time Simultaneous Measurement of Temperatures at Multiple Points
    Temperatures at up to 100 separate points can be measured simultaneously, and measurements are processed in real time.
  • Fully Wireless Design Dramatically Boosts Efficiency

The AirLoggerTM’s sensor unit, which incorporates a thermocouple data processor, wirelessly sends temperature data to a PC for display and saving. The WM1000 dramatically boosts efficiency by freeing users from the constraints of working with data cables.

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Die-Level Handling System Enables KGD Testing

Advantest’s new HA1000 die-level handler is a cost-efficient test solution for determining known good dies (KGD) prior to IC packaging.  It is the ideal solution for high-growth applications including mobile electronics and high-performance networking devices.  With economics a driving factor in die-level testing, determining a semiconductor device’s viability prior to packaging or building memory stacks is critical to avoiding rework, achieving high yields and lowering costs.  The HA1000’s ability to perform pre-assembly testing of singulated devices provides a new level of visibility into the quality of the device prior to committing additional devices and expensive packages to an assembly that could potentially have to be scrapped because of undetected problems.

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The new die-level handler allows full device testing to be performed before assembly, providing time-critical information that typically is only available at final test.  HA1000 is designed to handle a wide variety of devices from large high-power server/GPU type devices to small systems-on-chip (SoCs) and memory devices/stacks, such as HBM2.   The die-level handler can accommodate both thick and thin parts as well as stacks of 3D devices and partially or fully assembled 2.5D integrations.   In addition, the HA1000 is ideal to probe fine-pitch pads, bumps, microbumps and pillars.  Future applications of the system may also include probing of through-silicon vias (TSVs).

When joined together with the V93000 test system, Advantest provides a full test solution called the Die-Level Tester (DLT). This solution offers the following capabilities:

  • Handles large, small, thick or thin devices.
  • Can handle 3D stacks, 2.5D assemblies, and even partial assemblies.
  • Vision alignment aligns the probes to pads, bumps, pillars or TSVs
  • Automatic planarity adjustments to insure solid contact to non-flat surfaces.
  • Integrated high-power active thermal control system to speed the testing of large complex designs.
  • V93000 provides the ability to debug and test high-performance digital, analog, RF, and DC devices.

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Target applications for the DLT reap a variety of benefits:

  • Probing the singulated die just before assembly can improve final product yield while greatly reducing the cost of scrap.
  • Active thermal control at the die level allows full final-test execution in order to maximize later yields.
  • The DLT allows full testing of previously untested devices that may have been delivered from a multi-project wafer.
  • The DLT performs KGD final testing of products to be delivered in die form.
  • The DLT can speed time to market by allowing detailed device debug while blind product build takes place.
  • The DLT can re-screen die-bank parts, allowing them to be re-programmed to meet new needs or tested to confirm performance to new requirements.

Most importantly, the handler’s precision vision alignment system precisely positions probe points to the finest pitch in use today.  While properly positioning the chuck under the probes, the system can also adjust the planarity to match with the device surface to ensure a solid device connection. Its active thermal control (ATC) system enables the HA1000 to adjust on the fly to temperature fluctuations at the die’s surface over a very broad dynamic range of -40˚ C to 125˚ C.  The temperature of the thermal head quickly responds using a hot-cold fluid mix.  Thanks to low thermal resistance and high thermal capacity, the system can handle high-power devices with a thermal responsiveness often better than is possible in a packaged environment.   This allows manufactures to test parts at higher power levels and/or tighter margins, which can improve yields while reducing scrap.

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EM360: A 360 View of Test Equipment Management

Managing test equipment can be a daunting task when numerous ATE systems have been installed with different configurations, at different sites, and across multiple continents. Requirements range from system maintenance tasks, such as configuration management, repair and calibrations, to production planning and asset management.

Customers of Advantest V93000 systems can take advantage of a software tool created to help them overcome these challenges and enable them to manage their V93000 installation within and across test floors. The Equipment Management 360 (EM360) tool helps improve overall equipment effectiveness (OEE), system utilization and both time to quality and time to market.

Packed with features, EM360 collects data of V93000 system configuration, and calibrations in real time for the whole test floor, and provides an overview of the test floor configuration and calibrations. Customers can check the specific details of the configuration of each system, including hardware slots and pogo pin position as well as the software version of SmarTest, and the FPGA version of the hardware. It shows the hardware change-history to help track system repair and maintenance work. The calibration management features enable monitoring and management of all calibration schedules, including system, NIST, analog and radio-frequency (RF) calibrations, as well as direct-current (DC) updates.

The Configuration Search feature can locate the targeted hardware configuration within the entire test floor while the enhanced Advanced Configuration Search can use the model file from the test program to find a system with the matching pogo position, greatly facilitating production planning. The test floor summary and board trace capabilities can help customers understand the full hardware fleet, and trace each individual board.

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Key EM360 Features

  • EM360-Dashboard
    • Active Tester Status List –Enhanced
    • Configurable Column
  • Hardware Maintenance
    • Hardware Configuration
    • Tester Change History
    • Board Trace
    • SMT Version Management
    • Tester Comparison –NEW
  • Calibration
    • Calibration Overdue Report
    • Calibration History
    • Overdue Report–NEW
    • Diagnostic Log Collector–NEW
  • Tester Search (Tester Qualification)
    • Search
    • Advanced Search (by model file) –NEW
  • Asset –NEW
    • Floor Summary
  • System
    • Tester Setup
    • Support Time Zone Setup
    • Support Hostname Auto-change
    • User/System Configure
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Pin Scale SL: Testing High-Speed I/O Links

By Ulrich Schoettmer, Product Manager, and Frank Hensel, Application Expert, Advantest

Data rates for serial interconnect technology in CMOS are continuing to grow, driving the concurrent need for new instrumentation in automated test equipment (ATE).

Current serial technology has reached maturity – for example, PCI Express (PCIe) 2 and 3 running at 5 and 8 gigabits per second (Gbps), respectively, or SATA II running at 6Gbps – so robust standard library cells are available for various CMOS process nodes. For volume production, most manufacturers rely on DC tests, internal and external loop back tests, and therefore don’t require specialized high-speed ATE instrumentation.

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Figure 1. The Pin Scale SL is a fully integrated ATE instrument for super-high-speed operation.

However, the picture changes a bit when it comes to interface technology, which steps up to speeds of 10Gbps and higher. Particularly in the area of network processors, emerging advanced SerDes technology runs at data rates of 10, 12 and 15Gbps. These interfaces are operating in groups of eight or more lanes as “super-speed highways” in chip-to-chip or chip-to-peripheral links. Given the high levels of quality required, at-speed validation in manufacturing test is advisable to ensure that critical signal fidelity parameters are met at nominal data rates.

To meet this demand, Advantest developed a super-high-speed card for its V93000 tester platform: the Pin Scale Serial Link (SL). The Pin Scale SL instrument extends the speed and performance capabilities of prior cards in the Pin Scale family.

The Pin Scale SL is designed for SerDes, which is the serial technology used for such industry standards as PCIe, Serial ATA (SATA), Universal Serial Bus (USB) and a variety of networking interfaces. Transition to SerDes I/O links initially required significant design and validation efforts, which have proven worthwhile given SerDes’ overall benefits compared to conventional parallel I/O. These include better bandwidth, fewer I/O pads, and robustness against interference.

With a pin electronic which meets a bandwidth of 16Gbps, Pin Scale SL can serve the engineering and production needs of advanced SerDes technology. The new instrument comes with eight differential drive and receive lanes, each, on a single card.

Unique Properties of Digital High-speed I/O Interfaces

Serialized signals, instead of running off of a parallel bus, are packaged (serialized) onto a narrow path, so the serial path’s raw data rate has to be much faster to carry the same net bandwidth. Higher data rates go along with higher power, unless the signal amplitude is not minimized, but small signals are susceptible to interference and ground bounce. Therefore, serial links are usually implemented as differential lanes, which are far more immune to common mode noise. Due to the increased data rate, transmission line methodology also comes into play, so impedance control and termination become relevant.

At data rates greater than 10Gbps, frequency-dependent losses become a serious factor in printed circuit boards or cabling design. The I/O cells thus contain both active pre-emphasis structures on the drive side (finite impulse response, or FIR-based) and decision feedback equalization (DFE) on the receive (RX) side to overcome signal distortion and recover data. This makes the analog properties more complex and sensitive to process margins than in previous generations of chip design.

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Figure 2. Typical PLL bandwidth characteristics.

To simplify signal distribution, the clock reference transmission is eliminated by embedding the clock into the data stream, which leads to such encoding schemes as 8/10-bit encoding. Such coding guarantees a minimum transition density, which is the prerequisite for the clock data recovery (CDR) circuits on the receiver side to extract the clock signal from the (recovered) data stream and sample the incoming data. To ensure that the CDR circuits synchronize the sampling clock properly, it’s very important that the phase lock loop (PLL) circuit operates with minimum jitter and tracks phase variations of the incoming signal (see Figure 2). On top of the physical encoding, a transaction protocol is often utilized to organize and synchronize the data handling and ensure proper receipt of packets.

The typical list of tests needed to validate proper operation of the SerDes circuitry includes the following:

DC tests

Active equalization on the drive side is accomplished via dynamic variation in drive strength, creating a network of different current source settings that must be validated and may require trimming to work properly. Similarly, on the receive side, impedance matching resistor networks are used, which require trimming. As a result, precision DC tests are required to check output levels, swings and currents across the various settings, as well as precision leakage measurement, impedance measurements and the like.

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Figure 3. Eye diagram with 6-point mask

Pin Scale SL serves these needs by providing integrated parametric measurement units (PMUs) with accuracies in the <2mV and +/- 10nA range. These PMUs are available in parallel on each I/O pin, which allows full parallel measurements, minimizing test-execution times in production.

Dynamic AC tests

 Dynamic AC tests validate the functionality of the SerDes blocks at nominal data rates. A common methodology for the TX side is to perform an eye margin test and a total jitter test. While a high-bandwidth oscilloscope is suited for performing such tests in the bench environment for engineering purposes, a more streamlined multi-point eye mask test can be performed in the ATE environment, as shown in Figure 3. In the ATE environment, the measurement follows a bit error rate (BER) of a pattern stream-based approach, which allows for test coverage on both the TX and RX sides. For this task, the device under test (DUT) is turned into a test mode to generate a pseudo random binary sequence (PRBS) at full data rate, while the ATE receiver is used to scan the data stream along the voltage and timing, or phase, axis.

Figure 4. Signal quality of Pin Scale SL at 16Gbps using PRBS 7.

Figure 4. Signal quality of Pin Scale SL at 16Gbps using PRBS 7.

High-resolution verniers (i.e., movable graduated scales) for comparator threshold and sampling timing allow collection of detailed shmoo plots (much like a sampling scope plot) or may be used to scan to “open eye area” for eye width and height against a predefined multi-point mask. For very fast collection of total jitter budget measurement, a time measurement unit available on the Pin Scale SL card per pin/lane comes in very handy.

On the RX side, it becomes important to stress the signal recovery properties of the circuitry. For that matter, the ATE instrument sends PRBS signals to the DUT with high fidelity, an example is shown in Figure 4. By adding additional distortion (highly attenuated signals) and/or with superimposed jitter. Signal properties like drive amplitudes, signal equalization and jitter-injection generators are the programmable tools that come to play in order to emulate real-world, worst-case DUT conditions.

 Additional Measurements

Frequency offset tests are relevant to validate that the “remote” end of the communication path properly synchronizes to the data stream, especially in the networking application space. As a result, emulating a certain frequency (phase) offset between the TX and RX data streams to make sure the CDR still syncs properly is a mandatory test process. Programmable frequency verniers, down to the parts per million (ppm) offset versus nominal settings, are very helpful. Test vehicles for these tests are also PRBS signatures. Pin Scale SL supports the above tests via programmable PRBS generator and analyzer hardware blocks, which, again, are available on a per pin/lane basis.

Generic ATE tests

Besides their high-speed specific properties, these pins often also serve as the structural access path for all sorts of logic scan tests. For that purpose, the high-speed instrument also has to support “classic” pre-stored vector generation and truth table compare. Pin Scale SL also supports this use model and features a full-blown digital vector generation and compare engine behind every single node, which is fully compatible with Advantest’s mainstream digital pin card offering (Pin Scale 1600).

Protocol emulation support in HW

Pin Scale SL features a standards-compliant PCIe protocol stack, which allows high-level communication to the DUT. Other protocols, e.g. SATA, are also under development.

Looking Ahead

The Pin Scale SL Instrument provides enough headroom to be ready for the next generation of ASIC designs, which will be running 15Gbps links. PCI Express Gen 4, which is also under development, will be running 16Gbps and is anticipated to start emerging in 2015/2016. Besides standards, a number of proprietary SerDes links are under development that fall into the sweet spot of Pin Scale SL availability.

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