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Posted in Upcoming Events

Advantest Concludes Successful SEMICON West 2023 with Exceptional Booth Attendance

 

Advantest participated in SEMICON West 2023 on July 11-13 at the Moscone Center in San Francisco, California, which had a vast increase in overall attendance. There was a significant increase in foot traffic at Advantest’s booth as well, doubling the visitor count of last year. Advantest employees hosted many key customers and media outlets at the booth, showcasing our latest leading-edge test solutions.

Under the theme of “Beyond the Technology Horizon,” this year’s product showcase included our V93000 EXA Scale XPS module, inteXcell, ACS, T2000, and memory test platforms, highlighting our broad portfolio. We also promoted our ongoing corporate ESG initiatives. An AR/VR demo of the inteXcell and AI-generated portrait drawings from the ACS team, utilizing state-of-the-art technology, attracted crowds of interested parties who were eager to learn more about Advantest’s products. 

In addition to the product showcase, Advantest employees gave six presentations at the 2023 Test Vision Symposium. Advantest sponsored the 2023 Workforce Development (WFD) and High-Tech U (HTU) programs, offering industry insight to young professionals and students looking to learn more about semiconductor technology and career opportunities in the industry.

Thank you to everyone who contributed to the success of SEMICON West 2023, and we look forward to next year.

Advantest’s booth at SEMICON West 2023.

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Posted in Featured Products

Advantest Expands M4841 Handler with Active Thermal Control for Faster Device Throughput and Test Times

ATC 2.0 Option Enables Dynamic Multisite Sensing and Regulation of Device Temperature for Optimized Test of High-End Automotive SoCs

Advantest announced a new Active Thermal Control (ATC) option for its M4841 high-volume device handler in October. ATC 2.0 provides dynamic regulation of temperature fluctuations caused by automotive semiconductors self-heating during test, helping to ensure more accurate production test of up to 16 advanced systems-on-chip (SoCs) in parallel with higher throughput and shorter test times.

Massive amounts of data processing are required for devices used to power electric vehicles (EVs) and other fast-growing, data-intensive automotive applications such as infotainment systems and forthcoming Level 4 autonomous driving. Advances in semiconductor manufacturing processes bring improvements in functionality as well as enhanced power efficiency for these advanced devices. As a result, thermal design power is actually increasing, causing devices to self-heat during test and making it more difficult to control test temperature. This creates a need for handlers that can perform prompt, stable device temperature management.

Replacing the handler’s prior passive thermal control technology, integrated ATC enables the M4841 to provide a stable, consistent test environment with fast response and high load-tracking characteristics that maintain the device’s internal temperature at the set test temperature, even if dynamic heat fluctuation occurs during the test. This stability enables users to build test programs with unparalleled implementation flexibility – in turn, significantly enhancing overall test productivity.

Advantest’s M4841 handler with ATC 2.0 enables high-throughput test of up to 16 devices in parallel, yielding very high device volumes and supporting a range of complex ICs and packages. Its advanced performance capabilities and features make the M4841 the optimal test handler for high-volume production of devices used in consumer products such as portable digital equipment and automotive systems.

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Posted in Featured Products

Advantest Receives PCI Express ® Gen 5 Certification for MPT3000 Solid-State Drive Test Systems

MPT3000 Is World’s First SSD Production Tester to Be Certified by PCI-SIG® for High-Speed PCIe® Gen 5 Compliance Testing

Advantest announced in September that its MPT3000 solid-state drive (SSD) test system has become the world’s first SSD production tester to be certified by PCI-SIG® for high-speed compliance testing of PCI Express® (PCIe®) fifth-generation (Gen 5 or 5.0) devices. Advantest completed the rigorous testing process and was awarded certification in August 2023.

Previously approved for PCIe 4.0 compliance testing, the MPT3000 is now also approved for official PCIe 5.0 compliance and certification testing. The PCIe 5.0 certification was awarded specifically to two key products in the MPT3000 family: the MPT3000ES3 for engineering and the MPT3000HVM3 for high-volume manufacturing.

PCI-SIG compliance testing ensures not only adherence to the PCIe standard but also product interoperability, providing integrators with Add Newthe confidence to adopt certified products for their application needs. Only equipment that has passed the PCI-SIG’s intensive series of compliance tests – including electrical, protocol and interoperability tests – can be included in the PCI-SIG’s official Integrators List. 

Since its introduction in 2014, the MPT3000 has become the de facto industry standard for SSD test, with a broad installed base of customers that includes integrated device manufacturers (IDMs), fabless chipmakers, and outsourced semiconductor assembly and test (OSAT) providers. Combining Advantest’s expertise in high-speed system-on-chip (SoC) testing with state-of-the-art electronics architecture, the MPT3000 features multi-protocol capability and high parallelism to enable full performance testing of a range of SSD form factors.

As SSDs increase in speed, thermal management becomes a bigger challenge. The most recent additions to the MPT3000’s capabilities, announced in early August 2023, are the Independent Thermal Control (ITC) device interface boards (DIBs) and Engineering Thermal Chamber (ETC). These new thermal control products were developed to manage higher-wattage PCIe Gen 5 devices and are compatible with all SSD form factors tested on the MPT3000ES3 and MPT3000HVM3 systems, enabling manufacturers to accelerate testing within actively controlled thermal environments.

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Posted in Featured Products

Advantest Rolls Out Thermal Control Products for MPT3000 Solid-State Drive Test Platform

Independent Thermal Control Board and Engineering Thermal Chamber Targeting Early SSD Product Development Stages with Per DUT Thermal Control

In August, Advantest announced two new additions to its MPT3000 solid-state drive (SSD) test platform. The Independent Thermal Control (ITC) device interface boards (DIBs) and Engineering Thermal Chamber (ETC) target early engineering adoption of the MPT3000 by enabling efficient, small-batch engineering, quality assurance and early test development for SSD devices.

Advanced computing standards, such as PCI Express fifth-generation (PCIe Gen 5), enable higher-speed SSD devices with greatly expanded bandwidth for use in advanced data centers and other demanding storage applications. These faster, higher-capacity devices must be characterized and tested in thermal environments that accurately replicate operating temperatures.

Designed for device test qualification and validation, the ETC is integrated into the MPT3000ES3 test system to handle the highest-power PCIe Gen 5 DUTs. The unit enables accurate environmental temperature control within the chamber from -10 to 85°C, utilizing air flow to accurately condition up to 32 4-lane DUTs. The ETC is well suited for characterizing small batches of DUTs at a set temperature within the range stated.

Created for high-volume production test and qualification, the MPT3000HVM3 test systems support ITC DIBs, allowing the user to accurately set and maintain a constant drive temperature. Using active temperature feedback from the DUT, the fan speed is controlled to maintain a constant DUT temperature. This is an improvement from standard DIBs, which supply constant cooling air and allow the DUT temperature to fluctuate with the wattage of the test cycle. ITC DIBs feature air channels on either side of the DUT to maintain a constant DUT temperature on all DUTs, even during asynchronous testing cycles.

 

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Posted in Q&A

Test Needs and Solutions for High-End SoCs

Q&A Interview with Ralf Stoffels

By GO SEMI & BEYOND staff

High-performance computing (HPC) is a major driver for the SoC test market, in which Advantest holds a dominant share. Sustaining and extending this leadership requires capitalizing on the company’s already strong portfolio by pursuing new strategies. Our staff spoke with Ralf Stoffels, Advantest Executive Officer and V93000 Division Manager, who expanded on key points from a presentation given to Advantest investors in December 2022.

Q. Let’s start with the HPC market. What are some reasons it is such a driving force?

A. The semiconductor industry is widely projected to become a US$1 trillion market by 2030, with three segments representing 70% of this growth: automotive, wireless communications, and computing and data storage. If you look at the evolution of HPC, each new era has emerged more quickly than the last, and we are now at the point where the demand for processing high volumes of data has propelled us into the age of exascale computing (Figure 1). 


Figure 1. Each successive era of computing is evolving orders of magnitude more quickly than the one before, with HPC and AI driving the semiconductor industry toward the $1T mark by 2030.

Q.What are some of the specific HPC trends, and why are they pushing SoC test forward?

A. The technical trends for HPC illustrate the growing level of complexity in these applications. Key trends include: the rise of chiplets, which we’re seeing everywhere; new Arm server CPUs; larger packages for smaller nodes, which are being ramped by computing rather than mobile devices; 3D package constructs, from micro bumps to hybrid bonding; heightened power and thermal demands created by power supplies; and massive communication challenges created by very large, high-speed data networks.

Data centers, one of the primary applications for HPC chips, are essential for training and operating AI models, which are being employed for everything from autonomous driving to advanced chatbot assistants. In turn, this requires access to the tens of thousands of graphical processing units (GPUs) needed to analyze high volumes of data in real time.

All of these developments together create massive data requirements that result in new test demands to accommodate this 100x rise in complexity, which is pushing the ATE market toward US$10 billion by the end of the decade, as shown in Figure 2.


Figure 2. Fast-growing device complexity is driving the market size for ATE. These indicators point to the total available market reaching US$10 billion by 2030.

Q. HPC processors have a longer product development cycle than those for, say, smartphones. At what point in this process does test become critical?

A. During the early phases of product development, semiconductor manufacturers are focused on improving productivity while optimizing techniques essential to functionality. The need for test is particularly high during these early stages. HPC devices are no different in this respect. There are many test needs associated with ramping new nodes, and next-generation devices are always in development. While test is most critical during early development to achieve desired functionality and eliminate bugs, test needs will be consistently distributed across the lifetime of new and emerging devices.

Q. How has the V93000 contributed to Advantest securing its strong market position in SoC?

A. We’re addressing these complex demands with the latest offshoot of our flagship V93000 platform, the V93000 EXA Scale. Establishing V93000 as a scalable platform has allowed us to continually expand its range and functionality to accommodate testing devices for a wide range of applications. This flexibility is a core element of the V93000’s long-term success. We were also the first ATE company to establish long-term compatibility with a single test platform – this is crucial for customers migrating to the next generation of test capabilities. In addition, through our market leadership and customer relationships, we understand what lies ahead for the industry so that our R&D efforts continue to stay on top of HPC requirements.

Figure 3. Advantest has continually developed industry-first HPC-level capabilities for the V93000 SoC test platform.

Figure 3 illustrates the evolution of our leadership in HPC innovations, highlighting some of our computationally focused developments. One of the more recent of these developments is the XPS256 device power supply (DPS), which scales from milliamps to more than 1000 amps, covering all power requirements in a single DPS card. We are seeing a number of existing V93000 customers make the transition to EXA Scale for the system’s inherent capabilities as well as options such as the XPS256 and the Pin Scale 5000. When configured with these cards, the EXA Scale system is well equipped to meet exascale computing requirements for mobile, AI, HPC and other advanced devices.

Q. What else should readers know about HPC test requirements and how Advantest is addressing them?

A. Efforts to continue extending Moore’s Law rest on 3D integration – chiplets, stacked packages, FinFETs, etc. This technology is vital to the future of the industry, and it also generates new and different failure types that we have not seen before, necessitating new test approaches and faster testers. EXA Scale is the only tester that can reach 5Gbps on every pin and also has the deepest ATE memories, allowing it to deal with this advanced complexity. In addition, the XPS256 is fully integrated with the EXA Scale system and digitally controlled, so different channels can all be connected by a digital bus, so they can all be kept synchronized and completely controlled by the computational paths inside the system, with no analog factors. This has never been done before, and it allows us to be faster and much more precise in terms of controlling the voltage as well as protecting the device or the probe card. If something goes wrong, we can switch off immediately.

In addition, customers can execute software and interact with their systems via our Link Scale family of digital channel cards for the V93000 platform, which enables software-based functional testing and USB/PCI Express (PCIe) scan testing of advanced semiconductors. The card essentially behaves like your computer, communicating with the device under test through a standard high-speed serial interface to enable very fast transfer of functional and scan test content. Because the device can be interacted with on the wafer the way they’ll be used later on when they’re singulated and packaged, the user can increase test coverage and throughput simultaneously as well as realize faster time to market. 

As new HPC computing developments arise, Advantest is well-positioned to address concurrent test needs through our V93000 platform and continually expanding portfolio of best-in-class cards and peripherals.

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