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Advantest Draws Record Attendance to VOICE 2024 in San Diego


Advantest concluded a successful VOICE 2024 at the Hilton La Jolla Torrey Pines in San Diego, California. The event was held on June 3-5 and drew a record-high attendance of over 400 attendees, the majority of whom were Advantest customers and industry partners. This year’s VOICE event coincided with Advantest’s 70th anniversary, and the company was pleased to commemorate this milestone with longstanding customers and industry partners.

The VOICE 2024 committee received 225 abstract submissions from 40 global companies across 14 countries. Of those abstracts, 78 papers were presented over the course of the two-day event—the majority of which were written or co-authored by Advantest’s customers. The Artificial Intelligence (AI) track was added to this year’s technical program, in addition to a wide range of topics important to the automatic test equipment (ATE) industry, such as 5G/millimeter wave, high-performance computing, cloud technologies, and system-level test.

This year’s event also featured an exciting lineup of three keynote speakers, including Craig Nishizaki, vice president of the Test Solutions Group at NVIDIA, Marcelo Ackermann, professor of the XUV Optics Group at the University of Twente, and Andrea Lati, director of market research at TechInsights. In addition to keynotes, Advantest’s Kotaro Hasegawa and Michael Braun hosted a Technical Highlights session that featured Advantest’s latest solutions to address emerging test challenges for various applications including microLED and silicon photonics. Attendees also had the opportunity to engage with Advantest R&D engineers during the Technology Kiosk Showcase. Attendees were also provided valuable time to network with others during evening events and scheduled breaks. In addition, a Workshop Day was hosted after the event on Thursday, offering attendees a hands-on learning experience on advanced RF demodulation, Advantest’s new DC Scale XHC32, and SmarTest 8. 

The VOICE Partner’s Expo took place throughout the event, providing Advantest’s partners and sponsors the chance to meet with attendees and exhibit their latest products and offerings. This year’s headline sponsors were Alliance ATE Consulting Group and ISE Labs/ASE Group.

Best Paper and Best Kiosk Awards

Attendees used the VOICE mobile app to vote for the Best Paper and Best Kiosk awards. This year’s Best Paper award was awarded Bernhard Moessler from Infineon and Souvik Dey and Jubal Saji from Advantest, for their paper “Enabling Virtual Scope Capability on the V93000.” Advantest’s Brent Bullock also won Best Paper with, “Early Detection of CRES Degradation on High Current Power Planes.” Makoto Eiki of Sony was named as an Honorable Mention for his paper titled “Improving Efficiency and Robustness of Gaussian Process Based Outlier Detection via Ensemble Learning,” as was Jun Zhang, Bowen Yang, and Jiamin Wang of Advantest for their paper, “Boost the Performance of the Test Program Development Through Burst and Concurrency on SmarTest 8.” Keith Schaub and Nadine Schill from Advantest won this year’s Best Kiosk award for their “Advantest Talks Semi” kiosk. 

Visionary Award

This year’s Visionary Award was presented to Matt Silverstein, senior manager, audio product & test engineering, Analog Devices. Recipients of the Visionary Award are honored for their significant and sustained contributions to VOICE over time. Silverstein has supported VOICE by serving on the technical committee for twelve years and contributing papers to the technical program for the past three years. 

VOICE 2025

VOICE 2025 will be held in Austin, Texas at the AT&T Hotel and Conference Center on May 12-14. For more details, please go to: https://voice.advantest.com/

 

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Posted in Q&A

Interview with Doug Lefever, Representative Director and Group CEO

By GO SEMI & Beyond Staff

At the start of the new fiscal year in April, Advantest Corporation officially appointed Doug Lefever as its new Group CEO. Lefever has been with the company for 25 years, serving as Corporate Vice President, Group COO, and President & CEO of Advantest America prior to his new role. We interviewed Lefever to learn more about his plans as CEO.

Q: Could you start by telling us a little bit about your history with Advantest?

A: Advantest has been a major part of my life—and it would not be an overstatement to say that the company has helped to shape who I am as a person. I joined Advantest in 1998—just three years after I graduated from college. Since then, I’ve had the pleasure of watching this company grow into a global leader in ATE manufacturing. I have served in many different capacities in my 25 years with Advantest and have touched most parts of the company in some shape or form, growing long-lasting relationships with key customers and maintaining an in-depth knowledge of our test solutions. I’ve also had the valuable opportunity to participate in key business decisions that have played a part in Advantest’s success, such as the acquisition of Verigy in 2011, which is directly responsible for Advantest’s #1 position in SoC testers. 

Q: What are your plans for steering Advantest through current industry challenges? 

A: Under the leadership of Yoshida-san, we have achieved strong performance in the past few years, greatly increasing our revenues and market capitalization and becoming the world’s number one ATE supplier. To continue this success, we must focus on listening to our customers so that we can meet customers’ needs by supplying them with high-quality, cost-effective test solutions where and when they need them. To this end, we must remain flexible so that we can adjust to market and societal demands.

As semiconductor devices continue to become more complex, our role in solving testing challenges grows. Our customers face challenges in advanced packaging and temperature control. We need to invest more in advanced R&D to further research in test cells and test flows. This will require close collaboration with customers and business partners as we work together to overcome challenges. Our greatest strength is our customers. Our ability to respond and adapt to their needs, especially for mission-critical applications, is the biggest factor in our success. 

Q: What unique traits/characteristics do you believe you bring to the role of CEO?

A: I believe that change and growth come from within, and I think communicating directly with employees and getting to know people within the company is very important. For example, I often host “Coffee Talks” at the offices I visit. These are casual, free-form dialogues where I invite employees to ask questions, discuss market trends, and talk about recent innovations. I like to build trusting relationships with our employees and engaging with them directly allows me to learn more about their perspectives. 

I also see my technical background and long tenure at Advantest as having great value in promoting Advantest’s innovation and building customer relationships based on trust. This powerful combination is important to our continued growth and advancement.

Q: You will be the first American CEO in the company’s history. How do you plan to navigate managing a Japanese company with an American background?

A: Advantest is a global company with over 96% of our sales coming from outside of Japan. As such, I aim to bring a global perspective to the role while preserving Advantest’s roots. Our company was founded in Japan, and its corporate culture is deeply rooted in Japanese customs. I don’t want to change Advantest to fit an outside perspective. I aim to do the opposite: I want to bring Advantest’s unique corporate identity outside of Japan and expand the company’s global reach. I believe this will become even more important to our success and longevity as the semiconductor industry continues to grow around the world.

Q: Lastly, Advantest is celebrating its 70th anniversary this year. Could you say a few words about what this milestone means to you?

A: As I mentioned earlier, I have dedicated my entire career and most of my adult life to working for Advantest. This company is more than just a workplace for me; it is part of who I am. I am immensely proud to lead a company that has achieved such longevity and trust within the industry. We have been able to reach this milestone because we have not only kept up with but anticipated changing market needs. Moving forward, we will remain future-oriented and committed to achieving great things. We will also work wholeheartedly to fulfill our responsibilities to all stakeholders, including our planet. Achieving true sustainability in everything related to our company should be the cornerstone of our success.

I consider this milestone a huge achievement, and I am excited to commemorate it with my colleagues and industry partners in my new position as CEO.

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Posted in Top Stories

Advantest Ranks As THE BEST Assembly Test Equipment Supplier and the #1 Large Supplier of Chip Making Equipment in 2024 Customer Satisfaction Survey


In May, Advantest today announced it has once again received top ratings in the 2024 TechInsights
Customer Satisfaction Survey, capturing the No. 1 spot on this prestigious annual survey of global semiconductor companies for the fifth consecutive year.

Advantest has been rated on the 10 BEST list for each of the 36 years that the survey has existed. The survey ratings are based on direct customer feedback representing more than 60% of the world’s chip producers, which include integrated device manufacturers (IDMs), fabless companies, and outsourced assembly and test (OSAT) providers. 

According to TechInsights, Advantest has been named THE BEST supplier of assembly test equipment this year and every year since 2020. The company also RANKED 1st for the fifth consecutive year in the 10 BEST list of large suppliers of chip making equipment and was the only company to receive a five-star rating. Worldwide participants rated equipment suppliers among 14 categories based on three key factors: supplier performance, customer service, and product performance. The categories span a set of criteria including cost of ownership, quality of results, field engineering support, trust, and partnership.  

In the 2024 survey, Advantest achieved high customer ratings in the areas of Partnering, Recommended Supplier, Trust in Supplier, Technical Leadership, Commitment, Support After Sales, and Product Performance. 

The TechInsights annual Customer Satisfaction Survey is the only publicly available opportunity since 1988 for customers to provide feedback on suppliers of semiconductor equipment and subsystems. The 10 BEST, THE BEST, and RANKED 1st awards provide special recognition to suppliers rated highest by their customers. 

As a global provider of test solutions for SoC, logic and memory semiconductors, Advantest has long been the industry’s only ATE supplier to design and manufacture its own fully integrated suite of test-cell solutions comprising testers, handlers, device interfaces, and software – assuring the industry’s highest levels of integrity and compatibility. 

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Posted in Top Stories

Automotive Semiconductors Require Integrated Test Solution


The automotive semiconductor test market is experiencing organic growth as chipmakers produce higher volumes of devices serving an array of automotive applications. In addition, the range of applications for automotive-grade semiconductors is evolving as the technology advances. Manufacturers of automated test equipment (ATE) are adapting to ensure their systems can handle devices ranging from display drivers for all-electronic dashboards to silicon-carbide (SiC) power transistors for traction inverters.

Market data

The automotive industry’s use of semiconductors is growing, with carmakers now consuming about 8% to 10% of all semiconductors produced. This percentage is expected to rise as electric vehicles increase market share and as automakers outfit their vehicles with increasingly sophisticated advanced driver-assistance systems (ADASs). The trend is further driven by the increasing software content in vehicles to achieve higher levels of autonomy and by the migration of semiconductors once used primarily in luxury brands into mid-range and low-end cars over time.

According to Gartner, the worldwide automotive semiconductor market will grow from $67.5 billion in 2022 to $155.4 billion in 2032, when software-defined vehicles will surpass 90% of the total vehicles produced (up from 4.1% in 2022), unit production share of vehicles with internal combustion engines will drop below 60%, and autonomous vehicles above level 2 will reach 33.5 million, up from 4.2 million in 2022. (Level 2 implies partial driving automation in which an ADAS can handle steering and speed control, but a human must remain behind the wheel and be prepared to take control at any time.)

The automotive industry also presents demand fluctuations. At the height of the corona virus pandemic, for example, demand was aggressive and supplies were tight. Now, however, demand has moderated, supply chains have filled, and automakers have established second sources for many of the chips they require.

Expanding applications areas

Semiconductors have traditionally served a few primary applications in the automotive space. They have found use in engine control as well as the control of gear boxes, power windows, power steering, power brakes, seat heaters, and door locks. Microcontroller units (MCUs) typically handled the control functions, and they managed the sensors and actuators arranged in a distributed or zone architecture throughout the vehicle interconnected via a controller-area network (CAN) bus. For this scenario, a semiconductor test system that could test consumer-grade MCUs could easily handle the automotive MCUs, whose key difference was to meet automotive quality standards and to operate over the automotive temperature range. In addition, the standard battery voltage was 12 V,  so most available power and analog tester resources would suffice.

Today, however, technology has evolved, and cars contain many different devices of heightened complexity and higher voltage ranges. The traditional functions such as engine and gearbox control remain, but their requirements have become more stringent as automakers pursue higher efficiencies and, for internal combustion engines, reduced emissions.

HPC moves into cars

In this new scenario, high-performance computing (HPC) typical of servers is moving into cars to implement increasingly sophisticated ADAS capabilities that perform safety/life-critical functions. To help implement the HPC functionality, automakers are moving from a distributed to a centralized architecture, which requires massive data transfer from sensors throughout the vehicle to a central electronic control unit (ECU) incorporating a high-performance microprocessor unit (MPU), which in turn necessitates high-speed automotive network interfaces. Automotive MPUs compared to consumer devices have to fulfill more strict quality aspects, so typically the test coverage is increased, outlier detection is applied, and a burn-in test flow gets introduced. In addition, testing across a wide temperature range from -40°C to +125/175°C is a must.

Voltages increase

Other factors resulting from the evolution of automotive electronics include the move from 12-V to 48-V architectures to power adjustable seats, windows, heaters, and even mild-hybrid traction motors. ATE makers are developing higher voltage and current instruments to test the devices that enable these higher voltage architectures.

Hybrid electric vehicles (HEVs) and fully electric vehicles (EVs) add further test considerations, requiring not just MCUs and other low-voltage components but battery-management-system (BMS) devices and high-voltage power modules as well. HEVs present some test challenges, but they operate at comparatively low voltages compared with EVs, and their battery-powered driving range is only about 40 miles. 

In contrast, EVs delivering hundreds of horsepower incorporate converter electronics that can operate up to 800 V. In this respect, vehicle electronics is starting to resemble the electronics used in railway, wind-turbine, and solar-park applications, requiring high-power test methods. For EV traction inverters, automakers are increasingly turning to SiC devices because of their high-voltage capabilities and efficiency—SiC devices can extend the battery range of a high-end EV by an estimated 7% to 15%. 

SiC technology can prove to be challenging. For example, operations such as regenerative braking can stress the SiC devices, and automakers need effective test equipment to ensure the devices work. Of particular importance is the short-circuit test, which requires fast turn-off of the device. The test system must protect the device under test, the handler, the probe card, and the tester itself throughout 100% device test.

Meeting traditional and new requirements

Semiconductor test companies must be able to cover the gamut of devices—including DRAM, flash memory, MCUs, display drivers, and power devices—for both traditional and new automotive applications. They can leverage their capabilities for commercial applications to automotive devices, where the key differences include temperature range.

Advantest offers a complete lineup of test solutions to handle all automotive semiconductor test applications. For traditional MCUs and similar components, the Advantest V93000 and T2000 platforms perform high-quality cost-effective test at high throughput. Both platforms feature a module-based architecture that enables flexible reconfiguration through the rearrangement of functional modules according to the application. Available modules offer digital, high-performance analog, and power-mixed-signal capabilities for testing a wide range of devices, including advanced automotive devices for ADAS applications.

In addition to requiring HPC MCUs, ADASs require inputs from cameras, radar, infrared, and other sensors, which versions of the T2000 and V93000 can accurately test. Other automotive devices requiring effective test solutions find use in applications ranging from airbag deployment and antilock braking, where test is vital due to safety aspects. The tests can be performed using mixed-signal versions of the T2000 or V93000. Similarly, RF configurations of those systems can test devices ranging from radar sensors to infotainment system components.

Vehicles will continue to incorporate a variety of other devices, including traditional MCUs for dashboard functions, with all-electronic dashboards also requiring display-driver integrated-circuit (DDIC) devices. Advantest’s T63xx Series testers address DDIC test requirements across the -40 to +175°C temperature range.

For devices that require higher voltages and power levels than standard car components, Advantest offers test capabilities up to 2,000 V or >150 A using ganged power VI setups. High accuracy is also an important parameter for testing the latest generation of BMS devices. BMSs perform battery charging, protection, cell balancing, and battery state-of-charge estimation. Battery management systems present significant test challenges as cell stacks present more cells per BMS chip and accurate voltage monitoring becomes increasingly important to maximize usable capacity and extend cell life. 

To support BMS test, ATE will require high-voltage capabilities up to 160 V and the ability to provide highly accurate force and measurement performance <100 µV at high floating voltages. Advantest offers suitable and cost-effective test solutions to address all modern BMS ICs meeting the above requirements. 

High-energy test

Test equipment for high-power devices such as those used in traction inverters requires even higher voltage, current, and power ratings. The market for high-energy (HE) test equipment used to be relatively small, focusing on railway, wind-turbine, and similar applications. However, the EV market is poised to expand the requirements for HE test equipment that can handle 400-V/800-V operation. 

To address this market, Advantest in June 2022 acquired Italy-based CREA, whose products can test power devices manufactured by global semiconductor companies. The acquisition helps Advantest address the growing market for power semiconductors for a variety of efficient power devices, including SiC and gallium-nitride (GaN) implementations, as governments and industry pursue net-zero carbon emissions across a variety of applications areas—most notably the automotive industry.

The CREA product lineup features a chamber for bare die test that keeps temperatures under control and that maintains airflow to prevent sparking that can occur at high voltages. The company developed proprietary technology (called CREA LSI™) for its contacting system to achieve very low stray inductance, which improves device testability. CREA PCI technology provides protection for the device, probe card, tester, and handler against potential damage during short-circuit test, thus improving OEE (overall equipment efficiency) in production. In addition, the product lineup addresses the challenges of running high-energy tests in parallel.

The CREA product line complements the T2000 and V93000 to enable Advantest to provide full test coverage of the gamut of automotive semiconductor devices. Table 1 shows the full range of Advantest test solutions for semiconductor devices used across all automotive functions.

Table 1. Testers and handlers for devices and applications

 

Conclusion

As an automotive industry partner for many years, Advantest recognizes that electronics use in vehicles is evolving. Traditional electronic devices continue to find use, but new innovative products ranging from MCUs for HPC to power modules for use in traction inverters are becoming increasingly important. In addition, increasing electrification drives the need for more semiconductor testing to address high-demand, high-growth, complex requirements. Advantest recognizes the ever-broader requirement to create universal solutions that are customizable with user-friendly software to meet specific application needs. Advantest is uniquely positioned to see new technologies coming and to develop the solutions necessary to test them accurately, quickly, and cost-effectively.

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Posted in Top Stories

Getting the Most Out of ATE Test Seconds in the Chiplet Age


This article is a condensed version of an article that appeared in
EE Times on March 27, 2024. Adapted with permission. Read the original article here.

By Ira Leventhal, VP, U.S. Applied Research & Technology, Advantest America

In the 2023 movie BlackBerry, the head of AT&T Cingular explains to the BlackBerry CEO about Cingular’s strategy to sell data plans with the newly introduced Apple iPhone: “Do you know what the problem with selling minutes is? There’s only one minute in a minute.”

As someone working for a company selling “test seconds” for semiconductor devices, this got me thinking that there’s only one test second in a second. And while our customers may accept some additional test seconds to get a device to market quickly, those seconds need to settle back down to typical levels once devices ramp to high volume—or else those additional test seconds are coming right out of our customer’s bottom line. 

In the pre-chiplet/pre-heterogenous integration world, tester resources needed to be faster and more accurate than the device-under-test. While this requirement has certainly provided significant challenges over the years, we now face the added challenge of having to be smarter than the complex, multi-chip system-under-test.

And we must meet this added challenge as 2.5D and 3D packaging are reducing direct access to device pins, and general-purpose processors are giving way to artificial intelligence (AI) processors that serve multiple specialized applications. If you don’t take advantage of AI-based approaches, the companies that do are going to take away your business.

Making it happen

How do we squeeze more than one second of value out of one test second? The data collected during those test seconds can be combined with data from across the semiconductor value chain, enabling feed-forward and feed-backward applications for optimizing design, manufacturing, and test processes.

Multiple successes have already been achieved by connecting data from two or more manufacturing or test steps and taking advantage of improvements in machine learning and edge compute technology to gain more insight from this data. Continuing to build on these successes can achieve a critical mass that will fuel further development of the enabling technologies.

I believe we are just cracking the surface in terms of the additional value that can be extracted from the data collected during those test seconds. The creation and widespread adoption of innovative approaches for extracting this value will be a key requirement for success in the chiplet age.

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