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Posted in Q&A

Q&A Interview – Judy Davies, Advantest

 

By GO SEMI & Beyond staff

As COVID-19 continues its global spread, tech conferences and tradeshows are being postponed or outright cancelled to help protect the health of attendees, exhibitors and organizers. Advantest joined this effort with its VOICE 2020 Developer Conference, cancelling the Shanghai event and rescheduling the U.S. event in Scottsdale, Arizona, to September 29-30. Judy Davies, VOICE Ambassador and vice president of Global Marketing Communications, Advantest America, shares the company’s perspective on the outbreak and its impact, and offers a hopeful note for our industry and our world post-pandemic.

Q. What made you decide to reschedule the U.S. event as a live conference later in the year instead of holding a virtual event?

A. We actually did put on a virtual event, but this did not extend to VOICE 2020, which we really want to keep on the calendar. When large events such as the Mobile World Congress and the SEMICON China and Korea shows were cancelled, we needed a way to get technical information out to our customers and users – especially those in Asia, the first region impacted by COVID-19. To that end, we held our first virtual tradeshow in early March. We had nearly 200 attendees from 47 countries, with sessions presented in multiple languages by a global group of speakers. It’s such a great example of everyone pulling together to demonstrate their commitment to the industry and their empathy for the situation that we’re all facing. Instead of backing out – which would have been understandable – all the presenters were eager to participate.

This attitude has carried over to our program for VOICE U.S. Instead of cancelling, we have opted to postpone VOICE 2020 because Advantest is a leader in sharing technical information and this event is so important to our customers. By choosing a date later in the year, we’re looking to strike a balance – doing what’s necessary now, while continuing to innovate and maintain our industry-leadership role. We hope and believe that, by September, holding VOICE U.S. in person will be feasible. Everyone involved with the event has been accommodating and encouraging, stepping up to reaffirm their participation. Each of our four keynote speakers is confirmed for the new dates, as are our sponsors and exhibitors.

 

Q. Optimism and team spirit is certainly important right now. How does the theme of VOICE 2020 reflect this attitude?

A. The theme of the conference this year is “Your Voice. Your Vision. Our Value.” Advantest is here to support our customers – we hear their voice, we see their vision, and we partner with them to make it a reality. It really embodies our own vision (Adding Customer Value in an Evolving Semiconductor Value Chain) and our “INTEGRITY” core values. We don’t just give lip service to this concept – integrity is central to everything we do. We put together VOICE with this in mind, developing a program that truly reflects what our customers want and need to know to help them do their jobs even better.

 

Q. Speaking of the program, who will be delivering the keynote addresses this year?

A. We have a stellar lineup that comprises experts from within and outside the industry. On September 29, we’ll feature two keynotes on the future of test and technology. First, Steve Pateras, director of marketing for the Test Automation Group at Synopsys, will deliver a speech titled “Test Evolves – New Access to Adaptive Learning.” Following Steve will be Dr. Kate Darling, research specialist with MIT Media Labs. An expert in robotic ethics, Dr. Darling will discuss the future of human-robot interactions. On September 30, Dan Hutcheson, the well-known CEO of VLSIresearch Inc., will address 5G, IoT, AI and other critical IC markets, as well as some of the key industry trends he has identified and is following. Last, but not least, Fredi Lajvardi, vice president of STEM Initiatives at the Si Se Puede Foundation, will share his fascinating story about how he turned a group of high school students into a national-champion robotics team, beating top-ranked teams at the university level. I’m really excited to see all of these speakers.

 

Q. What else will VOICE 2020 hold in store for attendees?

A. The technical program has become known for the richness of the content provided. Our focus this year is on 5G with the theme being “5G: Made Real by Our Customers, Made Possible by Advantest.” Again, the focus is always on the customer and on the role we can play in helping them bring their ideas and plans to fruition. The program will feature nearly 70 papers divided into seven tracks, including new tracks on 5G/millimeter wave, parametric test and hot topics such as AI and machine learning. We’ll also feature our Partners Expo and several networking opportunities, including the off-site welcome reception and technology showcase on Monday night, September 28. And immediately following VOICE, we will conduct the Workshop Day on October 1.

 

Q. What else would you like readers to know?

A. I just want to reiterate how grateful I am to everyone involved with VOICE. This includes not only our keynote speakers, sponsors and other participants, but also our marketing team and the VOICE steering committee for all the hard work they’ve put in to make these events happen. Especially when there’s so much uncertainty right now, I can’t imagine being part of a company that is any more focused on partnering with and showing compassion for its customers.

I read recently a couple of quotes that summarize the notion that we’re all in the same boat, so to speak. Xiaomi, a Chinese consumer electronics company, donated thousands of face masks to Italy’s government, and on the crates was printed a quote from the Roman philosopher Seneca: “We are waves of the same sea, leaves of the same tree, flowers of the same garden.” Similarly, boxes of masks sent to China from Japan bore a quote from a Tang dynasty poem reading, “Foreign lands separated by mountains and rivers, we share the wind and moon under the same sky.”

Now, more than ever, these quotes truly resonate for Advantest. We have 5,000 employees, more than 80% of whom are located outside of the U.S., but we are all part of one world, and we are resilient. Things may be challenging right now, but we’ll get through it, together.

 

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Posted in Top Stories

Enabling Smart Manufacturing

 

By Tan Cheak Hong, Technical Pre-sales Manager, Advantest

Widely considered the next industrial revolution, smart manufacturing is quickly becoming an important aspect of semiconductor production and test. Combining the physical and virtual worlds, a smart plant can operate at higher levels of productivity and energy efficiency and turn out higher-quality products.

Today’s typical manufacturing site, however, incorporates a number of inefficiencies that can interrupt the manufacturing flow and impact the test process, potentially affecting test times and costs. The typical production test flow shown in Figure 1 illustrates some of these factors.

Figure 1. A typical test flow can be impacted by several factors that create operational inefficiencies.

The first factor is the test program itself. If the program is developed upstream on an engineering-level tester, it may not be optimized for downstream implementation, as the OSAT provider may have more limited resources for production. Next, human error can be introduced when an operator or engineer manually inputs the production lot information to set up the tester and handler. 

Further challenges can arise if there are errors in the position settings on the handler, so that it’s not optimized for production, which may cause it to jam. Physical problems are created when parts are loaded into handlers and waiting to be tested because of limited valuable space currently available on the test floor, or equipment breakdowns cause unscheduled downtime. Another issue is when a tester is localized with no connection to the back-end system; all data is stored in the local tester, filling up the hard disk and causing a slowdown and system crash if it is not monitored. Data that is collected but never utilized is a waste of resources.

Finally, additional opportunities for human error are introduced when lack of automation means that an operator just clear a jam or, at the end of a lot, perform a manual count and then reload the system for retest. Having to pause the flow so an operator to come and take care of these problems is highly inefficient. 

In a smart test site, these problems are eliminated. No human error occurs because the entire process is automated, from the start of the lot to execution of the test program. Everything is connected all the way through to ensure smooth operation and efficient use of resources.

Getting to automation

Advantest has developed a concept for through-factory solution to aid in automating the flow, from test cell to production (Figure 2). The manufacturing execution system connects an automated guided vehicle (AGV), used to move material efficiently through the line, to the integrated test cell “Virtual Gem,” or VGEM, Advantest’s patented SECS/GEM Interface Solution for factory automation. VGEM can be easily customized to meet a customer’s specific SECS/GEM requirements, and enables full factory automation with Advantest tester platforms. 

Figure 2. Advantest’s automated test flow solution resolves inefficiencies to enable optimized operation.

The Easy and convenient Operation ToolS (ECOTS) enables evolutionary factory automation. The smart test cell collects and integrates data from the handler and tester and then feeds it via data interface to the cloud, where AI techniques are used to analyze the data based on learned test conditions and provide actionable results. For example, AI can be applied to the measurement data to analyze prober pin cleaning, probe card lifecycle, probe quality, and other parameters. The tester incorporates a sensor to handle all the data moving through it so that the data collection and analysis can be performed quickly and seamlessly.

The ATE is also equipped with Advantest’s TP360 software toolset designed to enhance productivity. This value-added software performs test program debug/optimization and correction, helping speed up the test program release process. From there, the results are fed out to the EM360 equipment-management toolset. This smart toolset helps improve overall equipment effectiveness (OEE), system utilization, time to quality and time to market.

Figure 3 summarizes all the capabilities and efficiencies enabled by ECOTS. The solution was initially developed for the T2000 SoC/mixed-signal platform, and has now been ported to the V93000, T6391 and, soon, the Memory platform, allowing smart manufacturing techniques to be implemented for virtually any type of device.  Key benefits include automated recipe and equipment setup, wafer-map display, efficient resource management, improved uptime, real-time bin monitoring and equipment control, and statistical process control (SPC) capabilities, which use real-time data mining to adapt and evolve the flow to eliminate low yield, continuous fail/stop and other problems that can bring production to a halt.

Figure 3. Advantest’s ECOTS test cell solution is highly customizable and delivers a range of ease-of-use benefits to the user.

As automation becomes more widely integrated into the test flow, smart manufacturing techniques will become essential to ensuring the process is efficiently managed. Advantest has developed a unique solution, combining its proven ATE and handler technology with new proprietary software and interfaces, to enable customers to optimize their test flow, streamline test times and costs, and bring the new products to market more quickly

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Posted in Top Stories

Solving 5G Wireless Test Challenges

By Adrian Kwan, Senior Business Development Manager, Advantest America

Many companies, especially fabless chipmakers, are looking at how the 5G network will be formulated, as their products will need to change in order to meet the criteria for connecting to the network. Makers of sub-6GHz, millimeter-wave (mmWave), Wi-Fi, Bluetooth, WiGig and other types of chips are all looking at how they will need to adapt their future devices to this purpose. This is a broad challenge for the industry because the 5G network will be very different from the current 4G networks. Not only will network deployment need to change, but also the infrastructure, topology, base station deployment, and other parameters. It will require huge investment – everyone from semiconductor makers to mobile service providers to those building base stations will need to align to enable successful 5G deployment.

Today, we’re at a point where the infrastructure is beginning to be in place. Some countries have chosen to adopt sub-6Ghz for 5G and not pursue mmWave deployment, while more developed countries, e.g., the U.S., Japan and Korea, want to move immediately to mmWave so that they can begin deploying it in major cities. Of course, with the world currently in the midst of the COVID-19 pandemic, the supply chain is being impacted. There was already going to be a delay of a quarter or two getting products to market for those components which are manufactured in China, and while things are improving there, the rest of the world has yet to hit the top of the outbreak curve, so things are still very fluid to date. Opinions differ as to whether 5G deployment will be delayed, or if, in fact, the pandemic may actually accelerate 5G adoption.

Regardless, we are at the beginning of the 5G rollout. Few mobile products are currently being sold into the market to tap into the 5G network, mainly because mobile network providers haven’t fully deployed their 5G networks. From now through 2021, deploying the infrastructure will be critical so that it’s in place before 5G-enabled mobile devices begin to hit the mainstream market – which, we believe, will still happen sometime in 2022 timeframe.

As an ATE company, we deal with many customers in the fabless space, and these companies make devices that are challenging to test. ATE must therefore be at the forefront of what customers are doing and develop innovative solutions to help them address their test challenges. The 5G realm introduces a variety of new technology considerations, as shown in Figure 1, and these new areas translate into test challenges. To stay on top of these challenges, we have solutions that can be deployed to test almost any type of 5G device, whether FR1 (sub-6GHz LTE) or FR2 (mmWave). Moreover, we are already looking ahead to the newer Wi-Fi 6E frequency band, which will integrate into the 5G network when that convergence takes place.

Figure 1. Deploying 5G involves a number of key attributes, all of which pose new challenges for test.

Tech considerations, test solutions

As we know, 4G has deficiencies that 5G can overcome. With these improvements comes the need to deal with higher frequency bands, wider bandwidth, shorter coverage distances, signal penetration issues, and other aspects that impact how 5G is deployed in a city. While the next generation of mobile phones will have much more complexity and capability built into them than 2G, 3G and 4G models (Figure 2), most consumers won’t pay double or triple for a new phone, so phone makers will need a cost-effective test solution that can accommodate the added complexity. Fabless chipmakers and ATE providers are always looking into ways to reduce costs by implementing newer test methodologies, and customers are embracing new ways of performing RF and mobile wireless testing with these new test strategies.

Figure 2. Next-generation consumer devices will feature multiple antennas and other devices, further complicating the test process.

Test also depends on packaging. Packaging has evolved significantly over the past two years, impacting the way we handle and test devices, and 5G devices will necessitate changes in packaging. As an ATE company, Advantest collaborates with packaging companies to understand why and how they’re implementing new approaches to ensure that our systems will be able to handle these packaged devices. In addition to our core ATE business, we have expanded our device-handling business unit, acquiring companies to help us address requirements of higher-gigabit devices such as high-speed sockets and new load-board designs.

A key emerging driver for test is the growing trend of antenna-in-package (AiP) devices. We are moving toward higher-frequency bands in the mmWave space, and this is creating demand for components to be more compressed and consolidated into a single package. AiP technology is driving the trend toward FR2-type devices, in which the antenna module can be integrated with other pieces, such as the front-end module, in a single package or die that then has to be tested. This type of device will be required in multiple quantities in products such as advanced mobile phones or tablets, creating a huge explosion in volume when fully deployed. To help address this coming demand, we have developed new, contactless technology, currently in beta test, that will further advance our ability to handle AiP testing.

Currently, we have a proven platform solution in place, pairing our flagship V93000 tester with our Wave Scale test cards. The V93000 Wave Scale Millimeter targets next-generation 5G-NR RF devices and modules, and can address high-volume manufacturing requirements (Figure 3). The system is scalable and can deliver up to 64 bi-directional mmWave ports, allowing different 5G and Wi-Gig frequency modules to be used, as well as new modules to be added when new frequency bands being rolled out.

Figure 3. The Advantest V93000 Wave Scale Millimeter addresses customer requirements for wideband 5G-NR testing.

The V3000 Wave Scale architecture has extended its wideband testing functionality, so it can handle ultra-wideband (UWB), 5G-NR mmWave up to 1 GHz, WiGig (802.11ad/ay) up to 2 GHz, and AiP devices, in addition to beamforming and OTA testing. It also provides a pathway for customers to lower the cost of test for their current and upcoming 5G-NR devices while still making use of their existing investment in Wave Scale RF instrument. Like our other Wave Scale solutions, Wave Scale Millimeter is fully integrated with our SmarTest 8 programming architecture. Customers can use the software to generate a test program in just a few weeks with our latest mmWave library, further shortening time to development and eventually time to market for their 5G devices.

Conclusion

The requirements for 5G communications have become a key challenge for the ATE industry due to a jump in frequency range and bandwidths and the larger number of RF ports per device. The 5G standards are not yet final, and the industry is still learning how to test these devices, with efforts evolving as new devices are developed. As we’ve discussed here, Advantest has developed an ideal solution – the V93000 Wave Scale Millimeter – that is scalar, modular and can easily adapt to new technology requirements.

Our product portfolio, together with our consulting capabilities, enables Advantest to offer customers a one-stop service that meets all of their test needs. This is particularly desirable in the face of ongoing technology evolution and consolidation – not only for 5G, but also high-performance computing (HPC), artificial intelligence (AI), and other advanced technologies. Our exacting global customers want to have one place they can go to obtain a solution based on a whole architecture. This expansion of our offerings puts us in the forefront of addressing next-generation devices and new testing methodologies.

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Posted in Upcoming Events

Advantest Opens VOICE 2020 Registration and Announces Keynote Speaker for Scottsdale Event

Arizona Program to Feature Keynote by Social Robotics Expert, Dr. Kate Darling, and Evening Event with Performance by Violinist, Gabi Holzwarth

The Advantest VOICE 2020 Developer Conference will return to two popular locations – Scottsdale, Arizona on May 12-13 and Shanghai, China on May 22 – with the tagline “Your Voice. Your Vision. Our Value.” The learning and networking opportunities offered at VOICE through technical sessions, kiosk showcases, keynote speeches, partners’ expositions and social events will expand in 2020 to include a follow-up day of workshops on May 14 in Scottsdale. 

Online registration opens Wednesday, December 18 with discounted tickets offered for the Scottsdale event through March 27.

In addition to the early registration discount, group discounts are available to attend VOICE 2020; email mktgcomms@advantest.com for details. Those interested in attending the Shanghai event should email mktgcomms@advantest.com for registration information.

VOICE U.S. 2020 Highlights 

On May 12 in Scottsdale, the VOICE program will begin with a keynote speech by research specialist Dr. Kate Darling, a leading expert in robot ethics. Dr. Darling explores the emotional connection between people and life-like machines, seeking to influence technology design and policy direction. Named one of the “Women in Robotics You Need to Know About” by Robohub, she currently investigates social robotics and conducts experimental studies on human-robot interaction at the Massachusetts Institute of Technology (MIT) Media Lab. 

Dr. Kate Darling

That night, VOICE will host an evening event at G Collection, a rare and unique venue focused on showcasing classic European automobiles. The event, to which all registered attendees are invited, will feature the music of classically trained violinist Gabi Holzwarth, and the automobile collection of Scott Gauthier, an internationally acclaimed jewelry designer and car collector. Guest tickets are available for purchase by registered VOICE attendees.

Hotel Reservations 

Registered Scottsdale attendees are encouraged to make their hotel reservations at the Omni Scottsdale Resort & Spa at Montelucia before the discount ends on April 10. For additional hotel information and to make reservations, visit the VOICE website.

Sponsorship

A limited number of opportunities are available in both locations for companies interested in sponsoring VOICE 2020. Contact Amy Gold at amy.gold@advantest.com to learn more.

VOICE 2020 Quick Links

Registration

Workshop Day

Keynotes

Sponsorships

Hotel Reservations

Evening Event

Questions: mktgcomms@advantest.com

 

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Posted in Featured Products

Advantest’s New Modules and Test Head Extend the T2000 Platform’s Performance in Evaluating Automotive SoC Devices

Advantest Corporation has expanded the range of its T2000 platform with the launch of two new modules and a test head designed specifically for high-volume testing of devices used in automotive applications.  The new equipment is designed to enhance test coverage, enable higher parallelism and reduce the cost of test for system-on-chip (SoC) devices used in automobiles, a market segment that is projected to have a 9.6 percent compound annual growth rate from 2019 to 2022.

Semiconductor content in automobiles is increasing rapidly as ICs are becoming integral in everything from powertrains and infotainment systems to ADAS (advanced driver-assistance systems) and on-board safety features.   To reach their market potential, automotive SoCs require high-performance, cost-efficient test solutions.

The new RND520 test head has 52 slots, providing the highest pin count available with Advantest’s direct-dock testing option. As a member of the HIFIX (high-fidelity tester access fixture) product line, the new test head supports massively parallel wafer-sort testing.  It covers an area 40 percent larger than its predecessor while using center-clamp technology to ensure stable contact during wafer sorting. In addition, the test head can operate over an extended temperature range up to 175° C.

The enhanced 2GDME digital module leverages 256 channels to test a wide range of SoC devices used in automotive electronics including MCUs, APUs, ASICs and FPGAs operating at speeds up to two gigabits per second (Gbps). It features a dedicated high-performance parametric measurement unit (HPMU) for every 32 I/O channels, giving the unit an expanded current capacity up to 60 milliamperes (mA) for every I/O channel. The module also supports high-voltage applications by enabling electrical stress testing and arbitrary waveform generator (AWG) and digitizer (DGT) functions valuable for characterization purposes.

The new 96-channel DPS192A device power supply facilitates highly parallel testing of automotive SoCs with high pin counts.  This versatile module has a voltage range of -2.0 volts to +9.0 volts and a current range up to 3 amperes. The unit’s capabilities include enhanced slew-rate control as well as a trace function to evaluate power integrity, an averaging function that improves sampling rates for measuring supply currents and a continuous sampling function that enables a new test methodology for IDD spectrum measurement.

The highly flexible T2000 test platform is ideally suited for evaluating SoC devices and other ICs fabricated with small-lot, high-mix manufacturing methods.  The system enables users to respond rapidly to shifting market needs with minimal capital investment while also helping to reduce development times for new designs.

 

DPS192A

RND520

 

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