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Posted in Upcoming Events

Advantest’s Virtual Presence at SEMICON Japan 2020 Demonstrates Continued Industry Leadership

For the first time in 50 years, SEMICON Japan commenced as a virtual trade show in 2020.  This online event, which took place from December 11-18, provided a COVID-safe venue for innovative leaders to demonstrate their technology excellence and thought leadership in the semiconductor industry.

Returning as a gold sponsor, Advantest supported the SMART Mobility and SMART Workforce programs, along with Mirai College, an industry research event for university and graduate students. Advantest’s Koichi Tsukui, managing executive officer, also gave opening remarks at SMART Mobility 2, which featured executive speakers from Bosch and MIRISE Technologies discussing the evolution of autonomous driving and semiconductor technologies.

Advantest’s virtual booth showcased more than a dozen test solutions on digital display. This included new products such as the V93000 EXA Scale™  SoC test system; T2000 modules for CMOS image capture, digital and power supply; Advantest Cloud Solutions™, a cloud-based ecosystem enabling users to manage test data; and lastly, the H5620 high-productivity memory tester with integrated burn-in and memory-cell test functions—all in one system.

Additionally, Markus Knoch, Advantest’s director of product marketing, delivered a technical presentation “Testing in the Age of Exascale Computing,” and discussed the various challenges for testing future high-performance computation devices. 

Despite its online format, SEMICON Japan 2020 was another important opportunity for Advantest to demonstrate industry leadership, share valuable information and best practices with customers, and support the future semiconductor industry workforce.

SEMICON Japan Virtual lobby entrance.

Advantest’s virtual booth.

Advantest’s V93000 EXA Scale™ product showcase.

 

 

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Posted in Upcoming Events

A Flexible Approach to Advantest’s Technical Seminars Yields Success

Advantest’s annual Technical Seminar series in Asia took on many forms in 2020:  hybrid, in-person and virtual. Despite ongoing COVID-19 challenges, Advantest regions took strategic measures to cross-collaborate and organize successful customer events across the globe. While each seminar included multiple topics, all highlighted Advantest’s new V93000 EXA ScaleTM SoC test system.

Advantest’s 2020 Taiwan Technical Seminar took place for the first time as a hybrid event, setting an all-time high attendance record of nearly 300 customers. To ensure a safe environment, COVID-19 precautions were taken such as requiring masks, taking temperatures and arranging seating to maintain social distancing. Participants had the opportunity to attend technical presentations from both in-person and remote presenters and talk with Advantest product experts at interactive technology kiosks as well as participate in games and prize drawings.

Advantest’s 2020 China Technical Seminars took place as in-person events in three locations — Shanghai, Beijing and Shenzhen – with nearly 500 customers in attendance. Similar COVID-19 precautions, like wearing masks, were taken to protect participants while allowing them to enjoy an informative event in-person. 

Advantest’s 2020 Singapore Technical Seminar went fully virtual with more than 200 attendees. The seminar incorporated an innovative variety of approaches, including live presentations and kiosk sessions with local presenters, pre-recorded presentations with live Q&A, and educational videos of Advantest’s labs in Germany. The event concluded with a virtual lucky draw using an online prize wheel. 

Advantest thanks the many customers who attended and continued to support the annual technical seminars late last year, in all their flexible formats.

Gallery Images

Seminar attendees during general session (Taiwan).

Technology kiosk interaction between Advantest staff and attendees (China).

Virtual general session room with seminar agenda (Singapore).

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Posted in Upcoming Events

Virtual Flash Memory Summit 2020 Affords Advantest Opportunity to Share New Flash and SSD Test Solutions

By Jess Nguyen

Like most industry conferences last year, Flash Memory Summit 2020 went virtual for the first time on November 10-12, 2020, giving Advantest the opportunity to demonstrate its support of the storage and memory test industry. Advantest’s product showcase theme, End-to-End Flash and SSD Test Solutions, was reinforced by its virtual exhibit featuring cutting-edge MPT3000 and T5800 series memory testers. 

Advantest experts strategically leveraged digital collateral such as product videos, panels, and images to exhibit the latest product information to more than 3,000 conference attendees. With nearly all industry events going virtual this year, continuously learning how to adapt to an on-screen conference environment provided Advantest with imperative insight on how to effectively engage with strategic customers and prospective customers online.

As the world continues to navigate the uncertainty of COVID-19, Advantest is determined to continue fostering its valuable relationships with its customers, partners, and employees. Advantest hopes to see you at next year’s Flash Memory Summit, currently scheduled for August 3-5, 2021 in Santa Clara, California.

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Posted in Featured Products

Advantest Offers Two New General-Purpose Hardware Units Compatible with T2000 Air-Cooled Test Platform

Advantest has introduced two new general-purpose hardware instruments – the 500MDM digital module and the DPS32A power supply module – to boost the capabilities of its T2000 test platform for a variety of applications such as system-on-a-chip (SoC) devices, power-management ICs, automotive devices and CMOS image sensors for the growing digital transformation market. Both new hardware units can be retrofitted onto existing test systems, such as the T2000 AiR platform whose compact design is ideal for use in environments ranging from engineering labs to volume manufacturing.

The semiconductor devices being mass produced for today’s fast-growing mobile electronics markets run on low power to enable longer battery life. Testing these ICs requires the ability to accommodate small currents and fast processing speeds while also applying highly accurate parametric measurements, a highly accurate voltage-output resource and deep scan pattern memories.

To fulfill these needs with its established T2000 test platform, Advantest has launched the new 128-channel, air-cooled 500MDM digital module, capable of handling devices with data rates up to 500 Mbps. In addition to having a large 32-Gbit scan pattern memory, the module features a dedicated high-performance parametric measurement unit for every 32 I/O channels, giving the system an expanded current capacity up to 60 milliamperes (mA) for every I/O channel.

The digital module is complemented by the new 32-amp DPS32A device power supply, designed to handle all types of consumer electronic devices. This upgraded system can deliver a one-amp current load and four volts of power across 32 channels. Its high-resolution parametric measurements and continuous sampling function enable a new test methodology of delta IDDQ measurement and IDD spectrum measurement. In addition, the new unit’s ability to measure ultra-low stand-by currents represents an improvement over its predecessor, the DPS500mA power supply.

The T2000 AiR air-cooled test platform is optimized for cost-efficient testing in R&D and volume production. It delivers the fastest operating speed and greatest scan pattern memory among all air-cooled testers available today. The tester’s modular architecture provides maximum flexibility, including the ability to accommodate the new 500MDM and DPS32A instruments. Because the T2000 AiR does not require water cooling, it can be installed anywhere. Additionally, the system’s software is fully compatible with all products in the highly scalable T2000 series.

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Posted in Featured Products

Advantest Debuts Two New Advantest Cloud Solutions to Boost Production Efficiencies for New IC Designs

Advantest Corporation, working with its partner PDF Solutions Inc., has introduced two new innovative cloud-based software solutions: the ACS Dynamic Parametric Test (DPT) system powered by PDF Exensio® DPT, and an edge high performance compute (HPC) system. These solutions are part of the newly introduced Advantest Cloud Solutions™ (ACS), an ecosystem of cloud-based products and services. At the core of this ecosystem is the data- and analytics-focused platform, Advantest Cloud powered by PDF Exensio, which Advantest is co-developing with PDF Solutions.

Leveraging the core technology developed by PDF Solutions, the data generated from customer workflows is used to provide feedback on processes from semiconductor design validation to manufacturing, chip test, and system-level test. Customers can get more value out of their supply chain, their equipment, and their test data, to achieve faster time-to-yield with higher overall equipment efficiency by using advanced algorithms, integrated workflows, and methodologies delivered through Advantest Cloud Solutions.

Advances in semiconductor technology such as advanced process nodes, electrical scaling, 2.5D, and 3D packaging, and a new focus on systems present unique challenges that can only be solved through comprehensive software-guided solutions. Integrating traditional data silos throughout the semiconductor value chain can significantly improve product quality, manufacturing yield, and cost efficiencies.

The ACS Dynamic Parametric Test system powered by PDF Exensio® DPT, jointly developed by Advantest and PDF Solutions, adds rule-based, intelligent test flow adaptation to the V93000 SMU8 parametric test platform. With this technology, test flows are automatically optimized on-the-fly within milli-seconds to increase die test coverage, improve the characterization of aberrant measurements, correct equipment issues, and streamline the collection of additional data to support root-cause identification and down-stream analytics.

The new ACS edge HPC product can run complex test workloads with millisecond latencies and is available for early adopters. With pre-configured containers for machine learning (ML), demodulation, or other high-performance workloads, the system makes it easy to implement ML in semiconductor test. Besides allowing users to track, manage, and secure all containers from the cloud, it also provides on-demand access to previous insertion data through application programming interfaces (APIs) with built-in forward and backward data feeds. Customers can deploy machine learning models and algorithms in production, perform in-situ test flow optimizations, and remotely manage highly sensitive IP with maximum security.

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