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Posted in Top Stories

Trends in Testing: New Challenges Create New Opportunities

By Doug Lefever, Senior Executive Officer, Advantest Corporation, and President and CEO, Advantest America

As advancements in semiconductors and microelectronics soldier ahead into emerging, even uncharted, territory, new test challenges arise. To that end, let’s look at a few key trends and challenges that are driving opportunities for innovation in the test sector.

Technology convergence has been a buzzword for some time, and this trend is only going to intensify with the heightened need to move, access, and analyze massive volumes of data. As a result, data analytics technologies (Big Data, artificial intelligence [AI], and machine learning) will continue to play a vital role in driving test efficiencies – not just operational, e.g., improving overall equipment efficiency (OEE), but also transformational: enabling data to feed forward and backward between test insertions, as well as outside of test. The reality is that the lines are blurring between the front and back ends of test, and the insertion points change, depending on device type and lifecycle status. So, the test flows that happen throughout the lifecycle of the device need to be flexible.

Complex high-performance computing (HPC) and AI devices are growing very large, and because of interposers and bridging, their power requirements can exceed 1000W. This means that we need to be able to manage temperature with a high degree of precision during testing. These large devices also require additional compute and analytics capability during test. To this end, we developed our ACS Edge solution, which essentially adds a supercomputer alongside the tester to open up compute power and start to enable real-time adaptive test.

With these developments, the system will become enormously complex, requiring verification of entire systems (hardware, firmware/embedded applications, and software). This means we’ll be seeing a broader deployment of system-level testing (SLT) for both systems and modules, as well as SLT/ATE at the probe level for known good die, including active thermal management solutions. To this end, we’ve incorporated into our offerings the test-related accessories we acquired upon purchasing Essai, including sockets, thermal control units and other test subassemblies. Our value proposition rests in our ability to address the full hardware stack and in the comprehensive nature of our offerings.  

In the broader test arena, generation, validation, and optimization of required test content such as scan vectors, built-in self-test (BIST), and functional test (software code) will need massive support and cooperation between the EDA and ATE industries. Advantest has established strong relationships with the leading EDA providers to help drive these efforts. The industry is also going back and mixing functional tests more with structural tests, and more design-for-test (DFT) techniques are being added. While increased scan, serial high-speed scan over USB, and PCIe ports are being used, that still isn’t enough, which brings us back to SLT continuing to be deployed.

For 5G, test solutions are largely in place. Some high-volume manufacturing (HVM) device interfacing/interconnect technologies like over-the-air (OTA) are coming along, while test development is starting for advanced millimeter-wave (i.e., THz, 6G). There will also more use of on-chip sensors and agents to monitor device performance all the way through the fab, assembly and in-field. This traceability is vital to ensuring ATE plays a critical role in pulling data from sensors – this heightened need for data extraction and analysis is a recurring theme that permeates everything going forward.

Continued electrification of cars will also drive lots of growth in test, including challenging areas like high voltages – i.e., those greater than 1kV – which require different kinds of methodologies. These higher voltage requirements are also needed for silicon carbide (SiC) applications in vehicles. SiC, like gallium nitride (GaN), has been around for a long time and is finding new life in applications such as battery management. We can cover this with our mixed-signal configurations and our integrated power solutions.

With respect to packaging, we expect to see a bifurcation in the industry: HPC/AI will move to 2.5/3D ICs, while mobile will remain on monolithic 2D for a little while longer. We’re already into 2.5 and 3D, and we have been for some time. However, with hybrid bonding and die stacking, we’re moving into 3D IC. When that is fully implemented, it will bring some tough new challenges. We believe a holistic approach is required to create high-power solutions that will then be coupled with other chips in a package.

In addition, there will be new approaches to address the “memory wall,” such as large eRAMs, 3D stacked RAMs, co-packaging on 2.5D or access via serial I/O. Power consumption of I/Os may also drive the integration of optical I/O. The first step will be co-packaged optics (CPO), which involves heterogeneous integration of optics and silicon on a single packaged substrate aimed at addressing next-generation bandwidth and power challenges. 

As you can see, many technology trends have test requirements that overlap or coincide, with demands created by massive amounts of data generation and processing playing a massive role. Testing at the exascale level requires powerful equipment that can handle the challenge. We are meeting this challenge with our EXA Scale test system, built on our flagship V93000 architecture, which addresses the challenges of very high scan-data volumes, extreme power requirements, fast yield-learning and high-multisite configurations.

 

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Posted in Q&A

Q&A Advantest Cloud Solutions Ecosystem

Q&A Interview with Keith Schaub

By GO SEMI & Beyond staff

Earlier this year, our Q&A feature took a high-level look at Advantest’s cloud strategy and its role in helping to drive Advantest’s Grand Design. For this issue, we spoke once again with Keith Schaub, Vice President of Technology and Strategy, to drill down a bit more into the specifics of the Advantest Cloud Solutions (ACS) ecosystem.  

Q. First off, please explain what ACS is.

A. ACS is an open ecosystem created to help customers accomplish intelligent data-driven workflows. Architected to seamlessly connect and interoperate with customers’ existing data platforms, ACS comprises a family of cloud-based products and technologies based on a single scalable data platform. Conceptually, it’s similar to other cloud-powered service offerings you may be familiar with, but with a specific focus on enabling secure testing in the cloud. To this end, a key aspect of our efforts in this regard is education: customers need to know that their data and IP are protected when fed into ACS products.

Q. What products fall under the ACS umbrella?

A. We have deployed three production solutions in the ACS ecosystem thus far: the ACS Test Engineering Cloud (TE-Cloud™); ACS Dynamic Parametric Test (DPT™); and ACS Edge. Each of these solutions has a specific and complementary function that users can access and control via ACS in the cloud.

Q. Can you offer a brief description of each solution, and how they work together?

A.  ACS TE-Cloud is our test engineering solution platform that features a complete test development environment with an integrated set of software tools for developing V93000 test programs. TE-Cloud is a Platform-as-a-Service (PaaS) solution hosted in the cloud, which customers can access on demand anytime and from any location. Once logged in, they can remotely access V93000 testers without having to make a capital investment in physical test equipment. This makes TE-Cloud highly valuable for small startups, giving them easy remote access to tester resources at Advantest’s labs and those of our partners.

ACS DPT focuses on DC parametric test, also known as WAT or e-Test, typically performed in-line during wafer fabrication and at end-of-line when wafers are shipping from fab to wafer sort. DPT runs on all V93000 SMU8 parametric test systems, giving users greater control of the test flow as a function of the Process Control Monitoring (PCM) data. The product was jointly developed between Advantest and PDF Solutions and is built on their PDF Exensio® data analytics platform. Users across multiple geographies are implementing ACS DPT to apply test algorithms and die map topology, allowing them to gain greater insight into the causes of any unexpected results. The customer can use DPT to respond instantly to any issues, saving tester and engineering time, and to improve test cell efficiency by adjusting rules criteria and delivering downstream instructions to wafer sort.

 

ACS Edge is a high-performance, highly secure compute and analytics solution that lets users offload demanding workloads from the ATE host controller yet execute them much more quickly. The product connects to a user’s test equipment via a private, high-speed encrypted link to enable ultrafast decision-making during test execution. The user can develop compute-intensive applications that operate in near-real time on data generated by tests in the test program.

Data security is vital when dealing with testing at the edge. The applications are wrapped in a Docker container to simplify global distribution and management, while hardening them against compute environment changes. When it’s time to load the program, applications are pulled securely onto ACS Edge from the Container Hub, encrypted data is sent to ACS Edge and processed by the machine learning application, and the results are returned to the test program. All data and analytics IP are protected within a Zero Trust environment.

Q: You cite data protection, and you mentioned earlier educating customers about the security of their data. What does this entail?

A: It’s important for our customers to understand that Advantest uses Zero Trust principles to protect their data. The Zero Trust network security model is based on the principle of maintaining strict access controls over data and not trusting anyone by default, even those already inside the network perimeter. It requires strict identity verification for every person and device trying to access resources on a private network. It’s important to customers that we have these safeguards in place.

Q: What is the bottom-line impact for customers utilizing Advantest Cloud Solutions?

A: The ACS open ecosystem helps customers get more value out of their supply chain with focused workflow solutions for each stage of the IC design and manufacturing process. By implementing our ACS products and services, customers can boost their quality, yield, and operational efficiencies. Moreover, they can speed their product development efforts and thus introduce future products to market more quickly.

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Posted in Upcoming Events

First-Ever Virtual VOICE 2021 Developer Conference Receives Record-High Global Attendance

After being cancelled in 2020 due to the COVID-19 pandemic, Advantest held its 15th annual VOICE 2021 Developer Conference as an all-virtual event on June 21-23. The 3-day event attracted a record-setting 320 international attendees, with over half representing Advantest customers and partners. The 2021 conference drew participants from 53 unique companies hailing from 11 countries, including 20 new companies that had not previously experienced Advantest’s Developer Conference.

Yoshiaki Yoshida, CEO of Advantest Corporation, and Doug Lefever, CEO of Advantest America Inc., kicked off the conference by welcoming event attendees. This year, the Virtual VOICE program included 68 technical presentations from 21 companies covering eight topical tracks, and 22 technology kiosks highlighting Advantest’s latest test innovations.  The event incorporated 32 live sessions, giving speakers and attendees the opportunity to interact and exchange valuable information on best practices, test challenges, applications and solutions.

Additionally, Virtual VOICE featured a 13-company strong Partners’ Expo headlined by Alliance ATE and ISE Labs, two dynamic keynote speakers, and a featured industry talk on the semiconductor market by G. Dan Hutcheson of VLSIresearch Inc. VOICE concluded with an award ceremony and custom music video performance by classically trained violinist Gabi S. Holzwarth. 

Best Papers and Best Kiosk Award

Through an online poll, attendees voted to select the top two technical presentations and the best technology kiosk. 

Best Paper Award: 

  • “HSIO Loopback: The Challenges and Obstacles of Testing 112 Gbps” / Dave Armstrong – Advantest, Don Thompson – R&D Altanova
  • “Automotive Keyless Entry System-on-Chip Test Methodologies and Techniques” / Jonvyn Wongso, Krishna Vangapalli, and Daniel Marstein – Microchip Technology, Philip Brock and Louis Benton – Advantest 

Best Kiosk Award:

  • “EXA Scale Infrastructure and Utility Card” / Helmut Schmid and David Butkiewicus – Advantest

Visionary Award:

  • Derek Lee – NVIDIA 

The annual VOICE Developer Conference is made possible by the extensive organizational work of a Steering Committee, comprised of volunteer representatives from Advantest and its worldwide customer base and the support of event partners and sponsors

Check out the Virtual VOICE event highlights video here on LinkedIn.

We look forward to hosting VOICE 2022 as an in-person event in Scottsdale, AZ, USA on May 17-18, 2022. Watch the VOICE website for more details: https://voice.advantest.com/

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Posted in Featured

Advantest’s Hadatomo™ Z Photoacoustic Microscope Wins Laser Industry Encouragement Award

Advantest’s Hadatomo™ Z photoacoustic microscope received a Laser Industry Encouragement Award at the 13th Industry Awards sponsored by the Laser Society of Japan.

The Laser Society of Japan Industry Awards recognize “excellent achievements contributing to the development of the domestic laser-related industry in the practical application, and the dissemination of laser-related products and technologies,” according to the Society. Among several award categories, Encouragement Awards are given to products with notable potential for future market development.

Advantest’s Hadatomo™ Z simultaneously images the oxygen saturation of blood vessels with dual-wavelength photoacoustic technology, and dermal structure including skin texture, pores, and sebaceous glands with ultrasound. Accurately imaging vascular mechanisms up to a depth of 3 mm in the dermis makes it possible to observe vasodilation and blood circulation stimulation in near-real time. An optional dual-wavelength laser that can distinguish between melanin and blood vessels is also available. Currently, the product’s main applications are cosmetology and dermatological research, but its selection for the Encouragement Award underlines its future potential as a medical device. At the present time, the product is a scientific instrument, not an approved medical device.

This award reinforces Advantest’s commitment to developing the company’s photoacoustic technology further, so that the Hadatomo™ Z can contribute to the treatment and prevention of skin diseases.

The 13th Industry Awards of The Laser Society of Japan for fiscal year 2021

https://www.lsj.or.jp/en/the-13th-industry-award-on-the-laser-society-of-japan-in-fy-2021/

 

 

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Posted in Featured Products

New TAS74000TS Measurement Solution Enables Materials Characterization for Beyond 5G

Advantest introduced a high frequency resolution option for its TAS7400TS terahertz optical sampling analysis system. It features excellent cost performance and ease of operation, and a new option that provides a groundbreaking measurement method for high-frequency characteristic evaluation of radio wave absorbers and base materials, which are indispensable for Beyond 5G / 6G next-generation communications technology and for the millimeter-wave radar technology used in ADAS (advanced driver assistance systems). 

Vector network analyzers (VNAs) have been widely used to evaluate the transmission characteristics (transmittance, reflectance) and complex permittivity of various materials in the millimeter-wave and high-frequency regions. But in recent years, it has become important to evaluate these characteristics over wider bandwidths, raising issues with VNAs on account of the time and effort required to set and calibrate each frequency band.

Advantest’s terahertz optical sampling system addresses these issues by enabling batch measurement over a wide band, utilizing pulsed electromagnetic waves. Measurements are now possible with a compact optical sampling system (measurement environment), saving on cost and space. It is also possible to analyze surface frequency characteristics with the mapping measurement option. Furthermore, the frequency resolution and scan speed of the new option are 5x that of the previous product, making this an optimal solution for evaluating the high frequency characteristics of new materials.

The solution will be exhibited at JASIS, from November 8th to 10th, and at MWE 2021, from November 24th to 26th.

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