Pages Menu
Categories Menu

Posted in Featured Products

Advantest Adds System-Level Testing Capability for Advanced Memory ICs

Advantest installed its first enhanced T5851-STM16G tester capable of nonvolatile memory express (NVMe) system-level test coverage at a major manufacturer of IC memory devices. By expanding the capabilities of its established T5851 platform, Advantest addresses the growing market for testing NVMe solid-state drives (SSDs) using ball-grid arrays (BGAs) in automotive applications.

Over the next five years, the automotive market is expected to become the largest consumer of semiconductor devices. This growth is escalating demand for NVMe BGA SSD devices, which are crucial in advanced driver-assistance systems (ADAS). To develop and economically mass produce these key NAND Flash SSD devices, memory manufacturers worldwide need a highly reliable, cost-efficient test solution.

Designed to perform system-level testing of NVMe BGA SSDs, the T5851-STM16G tester is ideally suited for evaluating any generation of BGA SSDs in either an engineering environment or a high-volume production site. The highly versatile platform can handle devices with multiple protocols, including NVMe, UFS and PCIe, at speeds up to 16 Gbps. The system’s modular, tester-per-DUT architecture supports test flows required for system-level testing of up to 768 devices simultaneously. 

Advantest is taking orders for the T5851-STM16G tester. It is available either as a new tester from Advantest’s factory or as a cost-effective enhancement to users’ existing T5851 or even T583X units.

Read More

Posted in Featured

More than Moore or More Moore?

What’s Next in the Future of High-Performance Computing? In this episode, experts will discuss the plans for the coming era of computing and will reveal how the semiconductor industry is continuously evolving to address the looming high performance compute challenges — moving us beyond Moore’s Law. Listen in as John Shalf, Department Head for Computer Science at Lawrence Berkeley National Laboratory, and former deputy director of Hardware Technology for the Department of Energy Exascale Computing Project, helps us uncover how the semiconductor industry will revolutionize HPC over the next decade.  

https://advantesttalkssemi.buzzsprout.com/1607350/11331203-more-than-moore-or-more-moore-here-is-what-s-next

Read More

Posted in Upcoming Events

Advantest’s 2022 VOICE Developer Conference Concludes with Record Attendance

Advantest held its VOICE 2022 Developer Conference on May 17-18 in Scottsdale, Arizona, achieving maximum attendance and sponsorship capacity. Over 300 people attended the event, the majority of whom were Advantest customers and partners. The 2022 conference represented over 60 companies and included presentations of more than 60 technical papers over two days.

VOICE 2022 received 119 abstract submissions from 31 companies across 13 countries. A total of 66 papers were accepted for presentation during the technical breakout sessions, half of which were written or co-authored by customers.

In addition to the technical sessions, VOICE featured a Partners’ Expo, three highly rated keynote speakers, and a first-time “fireside chat” conducted between G. Dan Hutcheson, vice chair of TechInsights, and Manish Bhatia, executive vice president of Global Operations at Micron.

Through the VOICE mobile app, attendees voted to select the best technical presentations and best technology kiosk.  A Visionary Award was also named for ongoing, sustained support of VOICE by a customer.

Best Paper

  • “New ATE Testing Techniques Using PCI-Express with Link Scale-PCIe to Solve Scan, Structural, Protocol and Third-Party Integration Challenges” / Brendan Tully—Amazon, Mike Kozma—Advantest 
  • “Migrating the Test of Medium Power Mainstream SOC Devices Using UHC4T/DPS128 to a Single XPS256 DPS Solution” / Stefan Walther and Linda Hänel—Advantest 

Best Kiosk Award

  • “ACS Edge 2.0” / Sonny Banwari and team—Advantest 

Visionary Award

  • Gabriel Tellechea—AMD 

VOICE is made possible by the organizational work of a Steering Committee, made up of volunteer representatives from Advantest and its customers, and the support of event sponsors, which featured 22 companies, including two new participants this year.

We look forward to hosting VOICE 2023 on May 9-10 in Santa Clara, California. Keep an eye on the VOICE website for more details: https://voice.advantest.com/

Read More

Posted in Featured Products

Advantest Introduces Industry’s First Flexible DUT Interface 

Advantest launched its DUT Scale Duo interface for the V93000 EXA Scale SoC test systems, enabling the industry’s highest level of parallelism for testing advanced semiconductors. With this revolutionary interface, the usable space on DUT boards and probe cards is increased by 50 percent or more while wafer probe and final-test setups can accommodate component heights that are more than three times taller.

Advantest offers the industry’s first DUT interface with the capability to adapt either to the existing standard DUT board or probe card size or to switch to the new, significantly larger size. Using a unique sliding mechanism, users can effortlessly switch back and forth between both formats to adapt to specific application requirements.

Along with the new interface, a new super-stiff extended bridge achieves superior deflection performance in direct-probing setups. The unit’s universal design gives it the versatility to support a wide range of applications including digital and RF device testing. With its sophisticated sensing capabilities, the extended bridge delivers the industry’s best planarity and high manufacturing yield, ensuring highly accurate positioning and verification of probe card clamping.

“Our new DUT Scale Duo enables the next stepping in parallelism while embodying Advantest’s continuing emphasis on system compatibility by allowing users to utilize their existing DUT boards and probe cards with a new interface,” said Advantest’s General Manager and EVP, Jürgen Serrer. “In addition to protecting customers’ investments, our approach to delivering the most efficient test solutions also offers flexibility and simplifies fleet management on the test floor.”

Read More

Posted in Featured Products

Advantest Enables PCIe Gen 5 NVMe & CXL Device Testing on Proven MPT3000 SSD Test Systems

Advantest announced that its MPT3000 solid-state drive (SSD) test systems are the industry’s first with the ability to test PCI Express fifth-generation (PCIe Gen 5) devices, including those utilizing the new Compute Express Link™ (CXL™) interconnect standard. To help drive product introduction, qualification, and volume production demands associated with PCIe Gen 5 NVMe & CXL devices, several leading memory device makers have purchased multiple MPT3000 products, including MPT3000ES engineering systems, MPT3000HVM high-volume manufacturing testers and device interface boards.

PCIe Gen 5 enables high-speed data transmission—essential for data centers, artificial intelligence (AI), and 5G applications. CXL is an open industry standard memory interconnect that builds on the physical and electrical interfaces of PCI Gen 5 to provide high-performance connections across memory types. 

Advantest designed its flexible MPT3000 systems to meet testing needs for enterprise and client SSDs, helping shorten customers’ time-to-market. In addition to CXL test, key MPT3000 capabilities include testing up to 32 Gbps, increased sideband and high-speed support, and improved temperature management for high-wattage drives.

“We are committed to driving memory and storage test innovation by developing the first systems and boards that will enable testing for both PCIe Gen 5 CXL and NVMe SSDs,” said Indira Joshi, vice president, SSD Test Division, Advantest America. “By expanding our proven MPT3000 system’s capabilities to address PCIe Gen 5 CXL, we are well positioned also to expand our relationships with important customers in the memory market.”

Read More