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Advantest Ships 10,000th V93000 SoC Test System

Advantest recently announced that it shipped its 10,000th V93000 system-on-chip (SoC) test system to longtime customer Infineon Technologies, the world’s number one automotive semiconductor supplier. The milestone system is a V93000 configuration developed to address the diverse test needs of power, analog, microcontroller and sensor ICs used in automotive and microcontroller applications. Ever-increasing semiconductor content in today’s automobiles is creating a pressing need for the V93000’s combination of advanced test capabilities and leading cost-of-test savings.

“Advantest’s V93000 tester has proven to be a highly effective digital, power and mixed-signal tester for us. The partnership with Advantest has helped to enable fast time-to-market while hitting our challenging cost-of-test targets,” said Ralf Schuster, senior vice president, Test and Automation Technologies, Infineon. “We have worked with Advantest for many years, and we are pleased to be the recipient of the 10,000th V93000 shipment.”

In the more than two decades since its introduction, the flexible, scalable V93000 has become Advantest’s flagship SoC test platform. The company offers a wide range of V93000 options together with complementary test instruments – including universal analog and digital test cards, RF instrumentation and mixed-signal cards, and best-in-class DPS and floating-power VI cards – as well as the user-friendly SmarTest system software environment. The newest V93000 offering is the EXA Scale generation system for testing a wide range of devices, from current and future generations of low-cost Internet of Things (IoT) chips to high-end automotive devices, highly integrated multicore processors, and advanced digital ICs up to the exascale performance class.

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Posted in Featured Products

Advantest Targets High-Numerical Aperture (NA) EUV Photomasks with Industry-Leading E3650 MVM-SEM

The market for photomasks used in high-numerical-aperture (NA) extreme-ultraviolet (EUV) lithography is growing quickly as chipmakers seek patterning solutions for sub-5nm masks. To take advantage of this growth, Advantest is leveraging the capabilities of its proven E3650 multi-vision metrology scanning electron microscope (MVM-SEM®). Since its introduction in 2018, the E3650 has become the standard for EUV mask measurement, making the system well-positioned for the high-NA market.

Highly advanced masks are vital for the development of complex chips that consume less power, such as those implemented in mobile phones. EUV lithography was developed to accommodate the printing of sub-7nm mask features, which 193nm-wavelength lithography systems are unable to handle. However, single-pattern EUV reaches its limit at around the 5nm node. At 3nm and beyond, high-NA EUV, which enables scaling down to the angstrom level, offers a simpler approach than costlier and more complex EUV double patterning. According to ASML, “High-NA EUV will bring multiple benefits to the semiconductor market such as reduction of process complexity, yield improvement, higher resolution enabling printability of smaller features at increased density, and cost of technology reduction.”1

The E3650 MCM-SEM uses Advantest’s proprietary electron beam scanning technology to measure fine pattern dimensions on photomasks with high precision and stability. The system’s higher throughput enables massive measurement required by more complex patterning and an increased number of masks due to multiple patterning. Key features include fast move-acquire-measure (MAM) time, large field measurement, long-term stability of critical dimension (CD) measurements, design-based metrology support and 3D observation.

“The E5620 has proven its effectiveness in measuring masks for both 193nm and EUV lithography, delivering improvements in accuracy and throughput compared to earlier models in the E36XX series. These capabilities enable enhanced analysis as well as more efficient mass production of photomasks,” said Stuart Ainslie, senior director of business development, Advantest Europe. “Through its combination of unique features and our stellar global support, the E3650 has become the standard solution for measuring EUV masks. We look forward to capitalizing on this success in the high-NA EUV space.”

To learn more about the E3650, click here.

  1. “High NA EUV: development towards introduction at the customer,” SPIE Advanced Lithography and Patterning Conference, Feb. 2023

 

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Posted in Q&A

Advantest Cloud Solutions: Taking ATE to the Edge and Beyond. Q&A Interview with Keith Schaub and Michael Chang

By GO SEMI & BEYOND staff

Advantest Cloud Solutions (ACS) is growing quickly, comprising a robust group of offerings, as well as the ACS Solution Store. In this issue, we talk with Michael Chang, ACS VP and general manager, and Keith Schaub, Vice President of Strategy and Technology, Advantest America, to catch up on ACS and the group’s latest developments. Their comments are aggregated below.

Q. When we last conducted a Q&A around cloud solutions, ACS was newly established. As it gains momentum, can you reiterate its mission and share how ACS has evolved?

A. As we’ve discussed previously, customers have traditionally used the data generated throughout the semiconductor value chain – from design/evaluation through production to product/system-level test processes – for individual statistical details and yield improvements, but none of it’s been tied together cohesively. Our vision with ACS is to create an ecosystem that enables our customers to reap the benefits of data-driven workflows, leveraging our proven success in semiconductor test hardware to expand into software solutions. Since its inception, we have steadily expanded our offerings, as a glimpse at the ACS page on the Advantest website illustrates.

Q. How is the ACS group helping customers manage the fast-growing volumes of test data?

A. Everything is built on our real-time data infrastructure. We now know how to turn all the data that’s driving the digital superhighway into near-instant insights. With AI and machine learning (ML), we can take reams of data that formerly added little value and transform it all into continually improving insights and solutions. Traditionally, if you test a device and find that it fails, you have to take that test data offline, sending it to another team in another location to provide analysis and, hopefully, a solution. This approach takes time – usually weeks – creating a delay that chip companies and their customers can’t afford.

This infrastructure helps fulfill our vision for ACS, extending across the entire ecosystem to integrate data sources across the entire IC manufacturing supply chain. This is a revolutionary concept in semiconductor test, one that allows us to truly test the chip from start to finish and reap the benefits of the advanced insights garnered from this data like never before. Our solutions apply analytics models that enable real-time actions during production. Nothing is taken off the test floor; all analysis and action is taken in real-time during the actual test.

This streaming approach means that analytics can be completed in milliseconds, in a secure, zero-trust environment, so that fast, corrective action can be taken. Our model can be integrated into any test program, and because we offer compatibility across all Advantest hardware and software platforms, the solutions are seamless.

Q. Are there some markets for which these solutions are particularly needed?

A. The industry is moving toward zero defects in key sectors, such as the automotive industry. If one of the 1,400 or so chips typically found in our cars today were to fail, the worst that would probably happen would be that we might have to be inconvenienced by having the car towed. In an autonomous vehicle, this becomes a life-and-death proposition, so zero defects shifts from being a mere goal to becoming mission-critical. Similarly, for many medical applications, zero defects is not an option. If, for example, a surgeon is performing a remote operation for which complex chips are feeding him or her vital data, those chips cannot fail because someone’s life is, quite literally, on the line.

Q. What are the key elements that make up the real-time data infrastructure?

A. There are four main components. ACS Edge™ uses high-performance AI technology to improve semiconductor testing speed, accuracy and efficiency. It can quickly analyze large amounts of data and make decisions in real time, enabling faster and more accurate testing. ACS Nexus™ provides real-time, bi-directional control of data from distributed test floors across the semiconductor supply chain, and it works across different Advantest platforms. The multi-purpose ACS Unified Server supports compute, storage, application and container services while also providing zero-trust security for the test floor. Finally, the ACS Container Hub uses container technology to package, distribute, and run AI/ML and statistical workloads.

Q. Can you elaborate on what is meant by zero trust?

A. Zero trust is a security concept and framework that requires organizations to eliminate the assumption of trust from within their networks and systems. It prevents any user, device or application to be trusted by default, regardless of whether they are inside or outside the organization’s network. In a zero-trust model, access to resources is granted on a need-to-know basis, with strict identity verification and contextual information, such as the user’s role, device and network location. This approach helps organizations mitigate risks associated with advanced, persistent threats, insider attacks and data breaches by reducing the attack surface and preventing unauthorized access to sensitive information.

Q. How are you working with partners?

A. We developed ACS as an open solutions ecosystem where customers and ecosystem partners can develop their analytics applications on top of the real-time data infrastructure. With that said, we aren’t trying to be all things to all people – that’s not an efficient business model, nor would our customers trust it. For this program, we have engaged with key partners that have already developed a number of analytics applications and advanced test programs. These applications are fully compatible with both the data infrastructure and Advantest testers and can help analyze the essential data that our customers need, providing real-time solutions to potentially costly issues.

Customers know that time-to-volume is everything and that you can’t achieve TTV without effectively troubleshooting new and ever-more-complex chips. We’re looking forward to making some key announcements with additional partners who are major players that will bring even more value to Advantest Cloud Solutions. Joint solutions with ecosystem partners to drive smarter decisions at sort, final and system testing to improve quality, yield and efficiency are available today for demo, with production release set for fall of this year. All of these solutions will be available in the ACS Solution Store.

Q. How does the ACS Solution Store work, and how can customers utilize it?

A. The online ACS Solution Store is a convenient, trusted place for customers using Advantest ATE systems to discover, purchase and deploy production-proven, Advantest-certified apps developed by ecosystem partners. The store is an industry-first portal that drives and fosters innovation and enables the development of solutions that ultimately improve yield, quality, overall equipment effectiveness and time-to-market for the semiconductor manufacturing process. In addition, automated software can be distributed via the ACS Container Hub for containerized apps, which ensures easy, secure deployment of the apps in the test fleet. Libraries are bundled in a docker container image that executes reliably regardless of the surrounding hardware and software environment configuration.

In summary, we’re pushing the limits of what’s possible and taking test performance to new heights by elevating our edge and cloud infrastructure services. Through our ACS offerings, customers can transform their data into real-time production control, achieving excellent results and improved ROI. We look forward to updating readers on the latest developments in future issues of GO SEMI & BEYOND.

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Posted in Top Stories

Global Customers Rank Advantest THE BEST Test Equipment Supplier in 2023 and the #1 Large Supplier of Chip Making Equipment in Annual Customer Satisfaction Survey

By GO SEMI & Beyond Staff

Advantest has again topped the ratings chart of the 2023 TechInsights (formerly VLSIresearch) Customer Satisfaction Survey, capturing the No. 1 spot on this prestigious annual survey of global semiconductor companies for the fourth consecutive year. The company has now been named to the 10 BEST list for each of the 35 years that the survey has been in existence. The survey ratings are based on direct customer feedback representing more than 60% of the world’s chip producers, which include integrated device manufacturers (IDMs), fabless companies, and outsourced assembly and test (OSAT) providers.

According to TechInsights, Advantest, THE BEST supplier of test equipment in 2020, 2021 and 2022, was again the leading test equipment supplier in 2023. The company also RANKED 1st in the 10 BEST list of large suppliers of chip making equipment for the fourth consecutive year. Advantest achieved superior customer ratings in the areas of Partnering, Recommended Supplier, Trust in Supplier, Technical Leadership, and Commitment. According to TechInsights, Advantest continually ranks high among THE BEST Suppliers of Test Equipment and, in 2023, was once again the only ATE supplier to receive a Five-Star designation.

The TechInsights annual Customer Satisfaction Survey is the only publicly available opportunity since 1988 for customers to provide feedback on suppliers of semiconductor equipment and subsystems. Worldwide participants rated equipment suppliers among 14 categories based on three key factors: supplier performance, customer service, and product performance. The categories span a set of criteria, including cost of ownership, quality of results, field engineering support, trust, and partnership.

“Advantest continues to set new industry standards for product development and customer service, prioritizing its customers’ needs and supporting their success,” stated G. Dan Hutcheson, Vice Chair of TechInsights. “Through its broad product portfolio and expansive global network, Advantest enables its customers to create groundbreaking innovations that drive the semiconductor industry forward. Year after year, Advantest earns the highest ratings from the world’s global manufacturers and has topped the ratings charts once again.” 

“We are honored to be recognized in such high regard by our global customers and grateful to know that our partnering efforts are valued,” said Yoshiaki Yoshida, Advantest Corporation president and CEO. “As semiconductors become increasingly essential to our society, we will continue to deliver the leading-edge test solutions our customers have come to expect from us while driving innovation forward with sustainable products that meet not only their needs but those of the environment.”  

As a global provider of test solutions for SoC, logic and memory semiconductors, Advantest has long been the industry’s only ATE supplier to design and manufacture its own fully integrated suite of test-cell solutions comprising testers, handlers, device interfaces, and software – assuring the industry’s highest levels of integrity and compatibility.

 

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MMAF Option Enables Picoampere Measurements

By Yoshiyuki Aoki, T2000 R&D Hardware Manager, and Tsunetaka Akutagawa, SoC Marketing Manager, Advantest Corp.

Demand for low-current devices is increasing, as many new sensors are being created for medical, automotive, industrial, and other applications. Chief among the heightened production and test requirements for these low-current devices is the need to achieve picoampere (pA)-class measurements. Sensors’ functionality and efficacy, especially in medical and other highly sensitive applications, can be radically impacted by leakage current and drift characteristics. Thus, measuring very low current and detecting current leakage on the order of a few pA is becoming an important capability for general-purpose testers. 

However, conventional mass-production testers cannot easily measure pA and require a dedicated machine to do so. To this end, Advantest developed its Micro Micro-Ammeter-Frontend (MMAF) module option to connect to the MMXHE module for its T2000 SoC tester (Figure 1). Created for testing ICs in power trains, controls and sensors in electric and hybrid vehicles, the MMXHE (multifunction mixed high voltage) mixed-signal module provides 64 output channels to enable massively parallel, high-performance testing.

Figure 1. The current flowing through the sensor device is measured on the T2000 using the MMAF/MMXHE solution. It delivers high accuracy from the difference between the current value at the time of device measurement and the current value at the time of device open. 

The MMAF module measures pA-class microcurrents by increasing the current measurement sensitivity of key voltage source current measurement (VSIM) functions that MMXHE enables by a factor of 1000. This enables measurement of optical sensors and MEMS sensors, calculation of reverse leakage current of diodes, and so on.

Figure 2. Shown here is a mother test board with multiple MMAF installed.

Combining the two modules (MMXHE and MMAF) expands the T2000’s test coverage, enabling the system to deliver current measurements down to the pA level. The addition of multiple MMAFs makes it possible to measure a large number of devices simultaneously. With the MMAF module option, pA measurement can be performed at low cost without adding any modules to the existing tester configuration. In addition, because the module is small, it can be mounted on a performance board (Figure 2), so it can be easily adapted regardless of tester configuration.

In addition to its compact size/footprint and ease of multi-channelization, the combined MMAF/MMXHE module solution offers multiple benefits:

  • Wide source voltage range: 2V range / 7V range
  • Varied current measurement options: 3nA range / 30nA range / 80nA range
  • Low noise
  • Good measurement repeatability (Figure 3)

Figure 3. Using the MMAF pA measurement module, the T2000 can perform highly repeatable current leak measurements.

The new MMAF module option for the MMXHE joins a robust set of module options for the T2000 designed to address a variety of specialized testing requirements. These include multiple digital modules, device power supplies, a multipurpose parametric measurement unit (PMU), analog/RF modules (including arbitrary waveform generator/digitizers), additional multifunction modules for automotive and power-management ICs, and image capture modules for testing CMOS image sensors. Advantest continues to expand the capabilities of its T2000 tester to ensure its ability to accommodate a broad range of testing needs while ensuring full compatibility and ease of installation and helping to keep the overall cost of test as low as possible.

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