March 2019
TOP STORIES
TDR with Recursive Modeling Optimizes Advanced-Package FA
As the range and volume of chips developed for a host of Internet of Things (IoT) applications continues to escalate, conventional failure analysis (FA) techniques are increasingly challenged by the higher input/output (I/O) density and data throughput associated with complex 2.5D and 3D IC packages.
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Next-Generation Vehicles Pose Automotive Semiconductor Test Challenges
Various market trends are driving requirements for automotive semiconductor test as technology increasingly defines the future of the automobile. According to IHS Markit,1 the total market for semiconductors, having reached nearly $500 billion in 2018, will grow at a CAGR of 4.88% through 2022, while the automotive electronics category, reaching more than $40 billion in 2018, will outpace the total market, growing at a CAGR of 8.74% through 2022.
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GO POLL
This month’s GO POLL wants to know what you think will be a reality by 2056.
Share your thoughts by taking the GO POLL.
Have an idea for future polls? Email gosemi@advantest.com
FEATURED EVENT
VOICE 2019 Features Comprehensive Technical Program and Exciting Keynoters
For the first time, the Advantest VOICE Developer Conference will be held in Scottsdale, Arizona, on May 14-15, 2019, and in Singapore on May 23. Online registration is available for both venues.
VOICE 2019 will feature the latest and hottest topics in semiconductor testing, including RF, 5G, 4G, WiFi, MIMO, mmWave and a new technical track dedicated to Advantest’s T2000 platform. The heart of the conference continues to be its comprehensive learning and networking opportunities comprised of a technical program featuring more than 90 presentations; Partners’ Expo; social gatherings; Technology Kiosk Showcase; and innovative keynote speakers.
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SPOTLIGHT ON BUSINESS
Q&A Interview with Leslie Tugman, SEMI’s Vice President of Global Workforce Development and Diversity
As most of us in the electronics manufacturing supply chain are aware, the industry is facing a talent crisis and needs to fill the tech workforce pipeline with employees qualified to perform a plethora of available jobs. In this issue, we talk with Leslie Tugman, SEMI’s Vice President of Global Workforce Development and Diversity, about what SEMI and its member companies, which include Advantest, are doing to address this challenge.
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FEATURED TECHNOLOGY
High-Volume Consumer Devices Need High-Voltage Test Solution
If you’ve been increasingly feeling that your home doesn’t have enough electrical outlets for all of the consumer products you’re amassing, you’re not alone. As our hunger for consumer devices grows, so does our need for more AC-power wall outlets. The common denominator between large entertainment hubs, wearable and portable devices, and smart-home hubs/accessories is the need for AC power – either as a constant source or for on-demand recharging. Hand-in-hand with this requirement comes the need for reliable testing to protect these devices by ensuring their power supplies can handle the associated high voltage.
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FEATURED STORY
Looking to the Next (5th) Generation
The global semiconductor business is constantly on the lookout for the “next big thing”: the mass-market killer app that will drive the next wave of market growth for our industry. While candidates abound – thanks to the continued rise of applications utilizing technologies such as flexible sensors and augmented reality – the new NBT is shaping up to be the next generation of highly efficient 5G mobile networks. Long promised and finally on the cusp of coming to market fruition, 5G will far surpass current 4G LTE technology in both its highs (speed) and lows (latency).
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ADVANTEST NEWS
- Advantest to Feature Latest IC Test Solutions and Services Enabling 5G Technology at SEMICON China on March 20-22
- Advantest’s V93000 Wave Scale RF Testers are First to be Used in China for Volume Testing of AIoT Devices
- Advantest to Exhibit AI Test Solution on its Versatile V93000 Platform at SEMICON China Trade Show, March 20-22
- Advantest Receives Excellence Award in the Environmental Report Division of Environmental Communication Awards 2018
- Notice Regarding Completion of Conversion for Zero Coupon Convertible Bonds due 2019
- Advantest/W2BI Launches Portable Functional Test Platform for 5G Devices at Mobile World Congress in Barcelona, February 25-28
- AirLogger™ WM2000 Series Now Supported in US, EU and Thailand, Following China and Vietnam
- Advantest completes the acquisition of Semiconductor System Level Test Business from Astronics Corporation
- Advantest Participates in Meiwa Industry Festival Charity Bazaar
- Advantest Sponsors Event to Raise Awareness of Visual Impairment
- FY2018 Third Quarter Consolidated Financial Results is planned to be announced on Jan. 30 (15:00 JST)
- Advantest and Tohoku University CIES Demonstrate High-Speed Operation of 128 Mb Density STT-MRAM Using an Advantest Memory Test System
- Advantest to Exhibit Wide Range of Semiconductor Test Solutions Enabling 5G Connectivity at SEMICON Japan on December 12-14
- Presentation Material “3rd Quarter Fiscal 2018 Consolidated Financial Results” updated
- FY2018 Third Quarter Consolidated Financial Results
- Revisions of Year-end Dividend Forecast for the Fiscal Year Ending March 31, 2019
- Advantest Announces a New Photoacoustic Microscope ‘Hadatomo™ Z’
- Advantest to Showcase Latest Semiconductor Test Solutions Enabling 5G Connectivity at SEMICON Korea on January 23-25
- Advantest President & CEO Yoshiaki Yoshida Enters VLSIresearch’s Semiconductor Industry Hall of Fame as a 2018 “ALL STAR”
- AirLogger™ Series Now Supported in China and Vietnam
- 2019 New Year’s Address from President Yoshiaki Yoshida (abridged)
- VOICE 2019 Developer Conference Opens Registration and Announces Keynote Speakers for U.S. Event
- Advantest and Tohoku University CIES Demonstrate High-Speed Operation of 128 Mb Density STT-MRAM Using an Advantest Memory Test System
UPCOMING EVENTS
Please plan to visit or join Advantest at these upcoming events:
SEMICON China
Shanghai, China, March 20-22, 2019
http://www.semiconchina.org/
DATE 2019
Florence, Italy, March 25-29, 2019
https://www.date-conference.com/
GSA European Executive Forum
Munich, Germany, April 15-16, 2019
https://community.gsaglobal.org/customers/s/lt-event?site=a0d4100000D0fNUAAZ&id=a1U41000002gkGqEAI
VLSI Test Symposium
Monterey, CA, USA, April 23-25, 2019
http://tttc-vts.org/public_html/new/2019/?s=dates
SEMI SE Asia
Kuala Lumpur, Malaysia, May 7-9 2019
http://www.semiconsea.org/
VOICE 2019
Scottsdale, AZ, USA, May 14-15, 2019
Singapore, May 23, 2019
https://voice.advantest.com/
GSA Memory+ Conference
Shanghai, China, May 15, 2019
https://community.gsaglobal.org/customers/s/lt-event?site=a0d4100000D0fNUAAZ&id=a1U1K000003nacWUAQ
SWTest Conference
Rancho Bernardo, San Diego, CA, USA, June 2-5, 2019
https://www.swtest.org/
SEMICON West
San Francisco, CA, USA, July 9-11, 2019
http://www.semiconwest.org/