May 2017

TOP STORIES

Advanced Packaging Techniques Drive New Approaches to RF Test

The market for NAND flash memories is growing at a rapid pace, driven in large part by the massive demand for solid state drives (SSDs), which have replaced hard disk drives for many applications. According to Gartner, the SSD market will reach above 370 million units in 2020, and IC Insights forecasts that memory IC products will show the strongest growth rate through 2021 of the four major IC product categories (the others being logic, analog and microcomponents). Read More.

RF Test Requirements Driven by Emergent Package Integration

The many connected tasks we perform every day using advanced mobile products, such as smartphones, tablets and notebooks, are enabled by a somewhat dizzying array of wireless standards. These range from Long Term Evolution (LTE), LTE-Advanced, LTE-A Pro and LTE-M smartphone standards, to ZigBee, Bluetooth, GPS and Wireless Local Area Network (WLAN). The requirements and performance criteria for these wireless technologies differ according to their application – many of which revolve around the Internet of Things (IoT) – creating a host of technological challenges, including those surrounding packaging and test. Read More.

System-Level Test Essential for Fast-Growing Embedded NAND Market

FEATURED HIGHLIGHTS

VOICE 2017 Set to Kick Off this Month in Palm Springs and Shanghai – Technical Program Details Now Available for Both Venues

VOICE, the annual developer conference hosted by Advantest Corporation, will kick off its second decade on May 16-17 at the Hyatt Regency Indian Wells Resort & Spa in Palm Springs, Calif. The conference will again be held in dual locations, with the U.S. event being followed by VOICE China on May 26, at the Intercontinental Shanghai Pudong in Shanghai. Read More.

W2BI in the Spotlight at Mobile World Congress with New Test Automation Products for the Wireless Market

Advantest, together with W2BI ‒ an Advantest Group company that provides test automation products to help customers quickly launch high-quality smart devices ‒ showcased their newest test platforms for the wireless electronics market at the 2017 Mobile World Congress (MWC) in Barcelona, Spain. Read More.

SPOTLIGHT ON ADVANTEST MANAGEMENT

Interview with Ricky Sim

Singapore is home to the world’s top 3 wafer foundries, 30 major IC design centers, and offices for most of the leading fabless chipmakers and outsourced semiconductor assembly and test suppliers (OSATS). Similarly, six out of the world’s 10 largest semiconductor companies now have a presence in Malaysia. To learn more about the business environment in this region, we talked with Advantest Singapore CEO and Managing Director, Ricky Sim, who also shared his vision for the company going forward. Read More.

ADVANTEST NEWS

UPCOMING EVENTS

Please plan to visit or join Advantest at these upcoming events:

VOICE USA
May 16-17, Palm Springs, CA:
https://voice.advantest.com/

VOICE CHINA
May 26, Shanghai, China:
https://voice.advantest.com/

AUTOMOTIVE ENGINEERING EXPO
May 24-28, Yokohama, Japan:
http://expo.jsae.or.jp/english/

ISPSD 2017
May 28-June 1, Sapporo, Japan:
http://www.ispsd2017.com/

NORTH ATLANTIC TEST WORKSHOP
May 8-10, Providence, RI:
http://sites.ieee.org/gm-natw/

22nd IEEE EUROPEAN TEST WORKSHOP
May, 22-26, Limassol, Cyprus:
http://www.ieee-ets.org/

GSA MEMORY+ CONFERENCE
June 1, Shanghai, China:
https://www.gsaglobal.org/2017gmc/

SWTW 2017
June 4 – 7, San Diego, CA:
http://www.swtest.org/

GSA SILICON SUMMIT
June 14, Mountain View, CA:
https://www.gsaglobal.org/2017ss/

SEMICON WEST
July 11-13, San Francisco, CA:
http://www.semiconwest.org/

FLASH MEMORY SUMMIT
August 8-10, Santa Clara, CA:
https://www.flashmemorysummit.com/

GSA EXECUTIVE SUMMIT
September 26, Silicon Valley:
https://www.gsaglobal.org/2017usef/

ON THE LIGHTER SIDE…

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